Electronics Forum | Fri Apr 13 13:45:25 EDT 2001 | gsmguru
Just a guess-- Could you be seeing the nickel under the gold plating because you are removing some of the Gold with the Kapton Tape ? This should be easy to verify. Otherwise it sounds like things are pretty much covered.
Electronics Forum | Tue Apr 17 21:30:27 EDT 2001 | davef
The issue is on the table. Which is it? Are you ... * Loosing your gold plate when you remove the tape? [A tape test is a standard test for evaluating gold fingers. Check IPC-TM-650, test number wachacallit. Checkitaut.] OR * Putting tape o
Electronics Forum | Tue May 13 06:57:10 EDT 2003 | davef
Your vendor site is totally correct. 2Ag is an excellent solder, but it does nothing to prevent tin and gold from reacting chemically. An earlier poster is correct gold goes into solution in liquid solder very fast, less than a second. Gold and ti
Electronics Forum | Mon Feb 27 09:09:36 EST 2006 | davef
Silver on your copper or brass part is a solderability protection. The silver diffuses into the solder and you solder to the base metal, either the copper or brass in your case. Soldering to copper is well known. The issues are soldering to brass
Electronics Forum | Fri Oct 05 18:59:53 EDT 2001 | Dan Steffler
I have had an issue where solder has contaminated gold plated pads (fingers) where it is not acceptable. The pads must remain perfectly coplaniar for a LCD zebra strip to lay accross them. Does anyone know of a way to remove the marriage level of s
Electronics Forum | Thu Aug 21 22:10:07 EDT 2003 | adlsmt
Well, for some reason the board house will pay for the boards but has some issue with paying for the parts on them. Why am I not supprised? Perhaps I have mis-diagnosed the problem. We have found two different board p/n's with the same type of defec
Electronics Forum | Thu Aug 21 17:17:47 EDT 2003 | justin
Do some push / pull testing. Typically with black pad, you can flick the components right off the board. If you have this, the boards are about as reliable as a Yugo. If you get decent push / pull results, odds are you don't have black pad and you
Electronics Forum | Tue May 19 10:23:06 EDT 1998 | Mike C
| Howdy Richard, | Welcome to the club! I now dub thee a full fledged member of the "Spotty Gold Finger and Bleeding Ulcer Society"...or SGFBUS for short... (GRIN) | I know it's not funny to be in that position, but there's so many different places t
Electronics Forum | Mon Dec 13 10:12:45 EST 1999 | John Thorup
Hi Dennis The gold plating on a circuit board is present to protect the nickle plating from corrosion. The layer is so thin that as it goes into solution in the solder it constitutes only a small percentage of the total joint. It is commonly accept
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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