Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
A preparation for removing oxides and sulfides from electric contacts and for providing protection against corrosion, ensures non-obstructed electricity flow especially in the case of oxidized or worn contacts, can be used in audio products -high and
Electronics Forum | Wed Aug 19 03:33:45 EDT 2009 | rocko
Pay attention that sometimes the ultrasonic energy may damage ICs.
Electronics Forum | Wed Jul 29 10:46:04 EDT 2009 | babe7362000
I was wondering if anyone knows the best way to clean oxides off of fine pitch components? Apparently the paste we use does not have strong enough flux to remove the oxides off of the leads of the components. I have validated the profile and that i
Industry News | 2018-10-18 08:44:36.0
Lead-free Reflow Profile: Soaking type vs. Slumping type
Industry News | 2018-10-18 08:04:17.0
Influences of the solder material for the wave soldering machine soldering quality
Technical Library | 2007-07-19 15:15:11.0
ROSA is a surface restoration technique that removes hard to reduce species like metal oxides or sulfides. At the time of its development, the focus was on solderability and compliance to environmental regulations. Industry trends and regulatory changes as a result of the Montreal Protocol were the driver for much of the concern over environmental compliance. The result was an increase in the development of no-clean and water soluble fluxes and the removal of halogenated cleaning chemistries.
The Centurion™ is a forced-convection SMT reflow system with tight, closed-loop process control, built for today’s high-throughput PCB assembly environments. With the best heat transfer in the industry, the Centurion is able to run any profile at the
HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce production cost, create a greener environment and assist the quality process. Use special stirring system to melt
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Reduced Oxide Soldering Activation (ROSA) News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Reduced Oxide Soldering Activation (ROSA) American Competitiveness Institute
| https://www.eptac.com/faqs/ask-helena-leo/ask/charring-of-wire-insulation
. This oxidation is very difficult to removed and since only RMA or ROL0 fluxes can be used to tin the wires, this flux is not strong enough to remove these oxides and will not allow the solder to wet the wire strands
| https://pcbasupplies.com/s3x58-hf1100-3-600gm/
-remove protective layer and the antioxidant in the flux suppresses continued oxidation over time. Such effects help save the amount of activator needed for oxidation prevention, as well as the activator capping technique which allows maximum activation strength when the solder is molten
