Electronics Forum | Mon May 25 04:51:44 EDT 2009 | microdot
hi, we tried making a profile of a chip ATI 9000 mounted on a toshiba laptops, this is on a small pcb. the picture i have enclosed is used to remove the but when we tried to solder the chip using the same profile..it didnt work. Can anybody suggest
Electronics Forum | Thu Jun 28 15:22:59 EDT 2012 | spitkis2
Would like to ask end users or those with experience using infra red rework equipment (specifically when the top heater is IR) the following: 1. Can you successfully rework Package On Package (PoP) type devices? With heat directed through the packa
Electronics Forum | Fri Feb 20 08:56:42 EST 2004 | davef
We successfully clean WS flux on 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use no clean, because we cannot remove the flux residue from under them efficiently. Use ion chromatography testing to be sure it is clean under the BGA. IC is the on
Electronics Forum | Tue Jan 11 11:14:09 EST 2000 | Wolfgang Busko
What a challenge! I think it all depends on the equipment used. Seems rereflow of BGA isn�t that good (see the advices for wavesoldering BGA populated boards). Although you might check for the tacking force by sending a sample BGA board head over thr
Electronics Forum | Mon Jan 13 16:24:15 EST 2003 | russ
Youch! I know this is going to sound stupid but.... I have done it in the past in limited quantities. We placed capton (polyimide) tape at each of the four corners for a similar situation. It did work but the operator has to be careful in placing
Electronics Forum | Wed Apr 28 12:33:05 EDT 2004 | Dave G
Rob, Don't know if you bought an "H" tower with your UP or not. You did you can have a dedicated support plate made from Aluminum that has pockets machined out to match components on the bottom of the board. (Most of the workholder guys can set you
Electronics Forum | Tue Apr 01 09:58:52 EST 2003 | davef
You're entirely correct. The gold is most likely gone away. [Don't forget you can check if the surface is still solderable with a hand soldering iron.] We're not sure it it will give you the results you seek, but consider using a dye penetrant fai
Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
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