New SMT Equipment: remove solder balls for bga compoenent (6)

cleanroom wiper roll for printer wiper paper

cleanroom wiper roll for printer wiper paper

New Equipment | Cleaning Equipment

clean wiper roll are used to remove residual solder paste from the bottom side of PC Board stencils. Using Stencil Wiping Rolls prevents smearing, bridging, and solder balls caused by normal printing of solder paste onto PC Boards. Specifications:

Shenzhen Esocoo Industrial Co., Ltd.

SMT stencil clean roll for MPM smt machine

SMT stencil clean roll for MPM smt machine

New Equipment | Cleaning Equipment

smt stencil clean roll are used to remove residual solder paste from the bottom side of PC Board stencils. Using Stencil Wiping Rolls prevents smearing, bridging, and solder balls caused by normal printing of solder paste onto PC Boards. Most MPM pr

Shenzhen Esocoo Industrial Co., Ltd.

Electronics Forum: remove solder balls for bga compoenent (194)

looking for bga rework station

Electronics Forum | Thu Apr 08 16:25:38 EDT 1999 | greg c

I am looking for a BGA rework/placement system and would like any experience that you have had. I am looking for a system that is reasonable for the placment, removing and re-balling thank you

Re: looking for bga rework station

Electronics Forum | Fri Apr 09 12:46:10 EDT 1999 | Bob Barr

I have been using an Air-Vac DRS-22 for almost two years with very good results. Once a profile is developed it is very repeatable. The DRS-22 is no longer available, however. It has been replaced by the DRS-24. Unfortunately, the DRS-24 has a lo

Industry News: remove solder balls for bga compoenent (91)

Now Available: Amendments for J-STD-001F and IPC-A-610F

Industry News | 2016-01-17 19:26:58.0

In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.

Association Connecting Electronics Industries (IPC)

Precision PCB Services, Inc. Introduces Side View Camera for BGA Inspection

Industry News | 2020-03-19 11:12:48.0

Amid the COVID 19 crisis, Precision PCB Services, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern California and Dallas, Texas.

Precision PCB Services, Inc

Parts & Supplies: remove solder balls for bga compoenent (2)

JOT Optical BGA Rework Station PG-

JOT Optical BGA Rework Station PG-

Parts & Supplies | Repair/Rework

PG-P6860 Main Features: 1、 The top heater can move freely along the X, Y axis in the IR preheating area. It is good for many BGA chips distribution at different positions in the PCB board which need repair. X-shaped infrared laser can do rapid lo

Goodluck Electronic Equipment Co.,Ltd

JOT Optical BGA Rework Station

JOT Optical BGA Rework Station

Parts & Supplies | Repair/Rework

PG-P6800 Main Features: 1、There are 3 independent heaters. The 1st and 2nd hot-air heaters can control multiple groups and segments temperature parameters. The 2nd heater can move up and down. The 3rd large area IR heater can preheat the PCB boar

Goodluck Electronic Equipment Co.,Ltd

Technical Library: remove solder balls for bga compoenent (4)

BGA Placement on Rework Station

Technical Library | 2019-06-12 10:33:58.0

The success of ball grid array (BGA) placement on electronic assemblies is as much a matter of proper preparation and planning, as it is technique. In some designs, it is more appropriate to apply BGAs using a rework station that isolates the placement of the device, without subjecting the entire assembly to thermal reflow. This is especially beneficial in board constructions where the number of BGAs is limited, and the application of the solder paste is difficult, due to small pitch features that stretch the limitation of the stencil construction. Another application for rework stations, involves very large and thermally conductive BGAs, which will not uniformly reflow with other components on the assembly, and may require special process parameters for their proper placement. The most common use of BGA rework stations are for assemblies requiring BGA removal and replacements due to failures in the initial assembly stage.

ACI Technologies, Inc.

New BGA Solder Mask Repair Technique Using Laser Cut Stencils

Technical Library | 2007-02-01 10:08:40.0

The increased replacement of high lead count SMT devices with BGAs and other high ball count area array packages has brought increased challenges to PCB rework and repair. Often solder mask areas surrounding BGA pad areas are damaged when components are removed.

BEST Inc.

Videos: remove solder balls for bga compoenent (13)

BGA Rework Stations - How to Evaluate

BGA Rework Stations - How to Evaluate

Videos

Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/

Precision PCB Services, Inc

BGA Rework Stations - How to Evaluate

BGA Rework Stations - How to Evaluate

Videos

Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/

Precision PCB Services, Inc

Training Courses: remove solder balls for bga compoenent (12)

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Career Center - Resumes: remove solder balls for bga compoenent (1)

Process Engineer

Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support

SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.

Express Newsletter: remove solder balls for bga compoenent (994)

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) PRE OPERATIONAL REQUIREMENTS The following requirements shall

Partner Websites: remove solder balls for bga compoenent (230)

PCB Libraries Forum : Collapsing vs: Non-Collapsing BGA Balls

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_collapsing-vs-noncollapsing-bga-balls_topic1868.xml

= 0.15 mm but you must consider a 0.025 mm tolerance on the solder mask registration.  Collapsing vs: Non-Collapsing BGA Balls

PCB Libraries, Inc.

Solder Selection Guide

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide

. There are additional details of alloy and flux performance not covered that can be very important in the selection process. It is always worth a call to your Nordson EFD solder sales specialist to review requirements to ensure you are using the best solder paste for the job.   Step 1

ASYMTEK Products | Nordson Electronics Solutions


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