Industry Directory | Manufacturer
PCB Repairs of all kinds including-Solder on Tab (Solder Removal, Gold Plating), PTH & Delam repairs, etc.
Industry Directory | Manufacturer
Arizona ProCoat leads the industry in precision painting, conformal coating, potting and bonding
New Equipment | Assembly Services
> 6Spindle, 6 Flying Vision (FOV 24mm) Head -Batch recognition with 6 cameras while picking up 6 components -Processable components: 0402 ~ 21mm, H12mm >> Low-noise, low-vibration high-speed placement with Linearmotor -Suitable for Y-axis Linear Moto
New Equipment | Assembly Services
Hanwha HM510 SMT Assembly Line Hanwha HM510 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 60000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place ma
Electronics Forum | Tue May 16 15:53:09 EDT 2006 | Manvendra Verma
What is the solution for removing epoxy on BGA ics?
Electronics Forum | Fri Jun 02 22:46:21 EDT 2006 | mika
Is this the new Xbox 360 You are talking about? So the "modchip" doesn't work? Hmm... Can You please tell us what the purpose of the dissolution of the epoxy on the BGA You would like to do? /
Used SMT Equipment | Board Cleaners
Automatic Wash + Rinse + Cleanliness Test + Dry + SPC Lead Free Ready The SMT Series Cleaning Systems include the industry's most powerful batch-format drying system. The SMT series cleaners utilize a combination of convection and radiant heat t
Industry News | 2018-10-18 10:17:48.0
How to attach a thermocouple to a target PCB?
Industry News | 2010-09-22 15:01:40.0
Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.
Technical Library | 2021-09-21 20:20:22.0
The electronics industry has been using the epoxy puck for the processing of the vast majority of electronics microsections since the 1970s. Minimal advancements have been seen in the methods used for precision micro-sections of PCBs, PCBAs, and device packages. This paper will discuss different techniques and approaches in performing precision and analytical micro-sections, which fuse the techniques and materials common in preparation of silicon wafers and bulk materials. These techniques have not only been found to produce excellent optical results, but transfer effectively to SEM for high magnification inspection and further analysis with minimal post-lapping preparation needed. Additionally, processing time is reduced primarily due to a significant reduction of bulk material removal earlier in the preparation, therefore needing less removal at later lapping steps compared to traditional sectioning methods. Additional techniques are introduced that mitigate some classic challenges experienced by technicians over the decades.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
PCB pad repair technique demonstrated using the 2-part epoxy method. More on this PCB pad repair technique: http://www.solder.net/services/pcb-repair/pad-and-trace-repair/ More on the recommended epoxy: http://www.soldertools.net/pcb-repair-epoxy-r
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
Career Center | Colton, California USA | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
• Strong experience with the installation, training, and repair on a variety of electro-mechanical, pneumatic, PLC, or computer controlled systems. • Strong Knowledge in SMT equipment, Screen Printer, AOI/SPI, Conformal Coat Systems, Reflow oven, X-R
Imagineering, Inc. | https://www.pcbnet.com/blog/high-temperature-pcb-considerations-for-high-heat-applications/
) is greater than 170°C. The glass transition temperature is one of the most important properties of any epoxy, representing the temperature which the polymer transition from a hard material to a soft one
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/plasma-applications/semiconductor-packaging
, and reducing package delamination. Die Attach - Plasma cleaning of substrates improves the adhesion of the die attach epoxy via surface activation, which provides an improved bond between the die and the substrate
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