Industry News | 2009-03-18 14:52:46.0
Essemtec will highlight RO300FC-C full convection reflow oven with RO-CONTROL software in booth 2225 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2010-04-01 15:45:58.0
Carlsbad, CA – April 2nd, 2010: Machine Vision Products (MVP), a leader in Automated Optical Inspection will be announcing an expanded range of AOI systems at APEX 2010 in Las Vegas. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 16 years of service to the industry. MVP will be exhibiting at Booth 1647.
Industry News | 2011-04-05 21:42:34.0
Machine Vision Products (MVP) will be demonstrating its expanded range of AOI systems at APEX 2011 in Las Vegas. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at Booth 1647.
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2009-01-19 20:34:37.0
Essemtec, the leading manufacturer of surface mount technology production equipment, announces that it will highlight the printer SP150, the pick & place machine Pantera XV and the full convection oven RO300FC-C with RO-CONTROL software in hall no. 18, stand no. 338 at the upcoming COMPONEX NEPCON 2009 exhibition, scheduled to take place February 24-26, 2009, in Delhi, India.
Electronics Forum | Mon Jun 06 04:36:44 EDT 2005 | rlackey
It's not underfill is it?
Electronics Forum | Mon Jun 06 07:14:21 EDT 2005 | pci
We find it impossible to remove the glued chips > like the CPU and the UEm ICs in Nokia Mobile > Phones. They are both surface mount devices and > glued with some chemicals we think. Any help is > most needed in this matter. May we know what pr
Electronics Forum | Tue Oct 16 07:00:06 EDT 2001 | genglish
Hi all, I have a problem and would gratefully take on suggestions, firstly let me explain the situation: We are currently screen printing adhesive, using a method similar to DEKs 'Pump Print', The adhesive we are currently using is supplied from Alp
Electronics Forum | Mon Aug 21 16:37:46 EDT 2006 | davef
We too doubt that you have super glue on your BGA. If you want advice on removing super glue, look here: * http://www.supergluecorp.com/removingsuperglue.html * http://www.loctiteproducts.com/questions.asp?answerme=116
Electronics Forum | Thu Aug 17 09:57:16 EDT 2006 | jwn
Hi all, I need to find a solution for a problem I have. I need to replace BGAs which have been glued to a laptop board with superglue (Loctite). How can it be done without removing the pads when trying to remove the foreign glue? thanks in advance
winsouce.jpg)
.gif)
