Electronics Forum | Thu Jan 31 07:02:00 EST 2002 | martino
The whole process counldn't be easier. The sales reps' try to turn the whole thing into some crazy black art-its not. The stencil supplier will have their own standard 'glue dot' configurations, and 9 times out of 10 these are more than adequate. As
Electronics Forum | Fri Oct 22 07:35:02 EDT 2004 | davef
Most glue suppliers recommend chemicals and methods for removing the product from stencils. What does yours suggest? Further, search the fine SMTnet Archives for background discussion.
Electronics Forum | Mon Aug 24 08:44:52 EDT 1998 | Justin Medernach
| | | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | | Must be resistant to solvents such as MEK and acetone. | | | Cure below 150C, with possible potential for rework of the conec
Electronics Forum | Sat Aug 22 16:07:31 EDT 1998 | Manuel Cornejo
| | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | Must be resistant to solvents such as MEK and acetone. | | Cure below 150C, with possible potential for rework of the conections.
Electronics Forum | Mon Jul 29 15:24:07 EDT 2002 | OhioD
Interesting. From the reaction we got from DEK, I thought we were the only ones with pumpprint woes. We've tried 1 stencil with Bioact SC10, Hydrex SP&WS, Axarel, and Loctite remover on both Heraeus and Loctite glues. Some we spray, some we work-in m
Electronics Forum | Mon Jan 13 16:24:15 EST 2003 | russ
Youch! I know this is going to sound stupid but.... I have done it in the past in limited quantities. We placed capton (polyimide) tape at each of the four corners for a similar situation. It did work but the operator has to be careful in placing
Electronics Forum | Wed Apr 26 10:59:54 EDT 2000 | Jose Baez
Sal: You are Correct running firts the reflow side then glue side. In my Experience I've seen a reverse procesess( first glue"cure" and then reflow side) but the quality results were not good, because We realized the Glue tent to cristalise and when
Electronics Forum | Fri Aug 24 11:31:59 EDT 2001 | Stefan
Are you saying that the sensor is mounted onto the output conveyor of the glue machine and wired into the Onserter? If so ( weird, because the glue machine should have a SMEMA interface ), than you could mount the sensor on the input conveyor of the
Electronics Forum | Fri Jun 21 13:05:58 EDT 2002 | surinder
Hi Stephan, Thanks,Yes there are thieving pads on Ic's .Also the two QFP, which mention,that will be removed by modifying the design in long run ,if the results/Yields are okay as with Glue as Compared to solderpaste process. Yes you are right here,b
Electronics Forum | Wed Apr 07 14:12:53 EDT 2004 | Paul
The easiest way to remove air bubbles from any fluid is to place it into a vacuum chamber. I do this almost daily with liquid rubber coatings, glues, and plastics.
