Electronics Forum | Sat Oct 27 12:01:32 EDT 2001 | Stefan Witte
Most of the machine suppliers Fuji, Siemens, Universal and Panasonic did regret that they were building glue machines. Applying adhesive compared to placing a component looks so simple, but it is not and the defect rate is higher than placing 1206 c
Electronics Forum | Tue May 20 05:01:27 EDT 2003 | gavinscott
Hi, I have had this problem in the past and the best method I found was... Before removing the old syringe and fitting a new one, ensure the viton tubing is doubled over and pinched. This will help to eliminate any airlocks in the viton tubing whic
Electronics Forum | Wed May 25 10:01:59 EDT 2016 | stevedc
I tend to get issue on and off with the feeders either stalling and/or running slow/noisy. They are actually pretty easy to clean and maintain. If you take off the side panel of the feeder you will see a few gears, belts and a motor. The first thin
Electronics Forum | Thu Dec 07 20:28:07 EST 2006 | davef
When rushing to get a job done, it's easy to accidently remove solder mask from a nearby via when dressing BGA pads after removing the part. Just hit the via with some super glue [then say a small prayer] and push on. As an alternative, look here:
Electronics Forum | Thu Jan 31 05:51:46 EST 2002 | Matt
What tempurature is used to cure the glue and for how long? What happens if a component that has been glued and soldered needs to be removed? mk
Electronics Forum | Tue Oct 24 17:31:57 EDT 2006 | SWAG
We have a SMT part that has been adhered to a board using Loctite 3609. I can't find anything in the product specs. on how to release the bond to remove the part. Does anyone know?
Electronics Forum | Tue Aug 10 13:05:57 EDT 1999 | ScottM
| Folk's, | | I'm looking for some helpful suggestions for reworking wave soldered bottomside components that have been glued. | I'm not a fan of the twist and break approach and as some of them either have a double dot or a slot configuration this
Electronics Forum | Mon Feb 24 20:51:52 EST 2003 | davef
Ryan, You are spot-on with your analysis of the 'flattened' glue deposits. How about this for a different approach[es] in explaining your method for removing caps from your board? * George Verboven has speculated here on SMTnet that the downward fo
Electronics Forum | Mon Dec 11 03:46:14 EST 2000 | JohnW
I have to say I've never heard of anything tombstoning over wave, I've seen issues where the glue dot is too high or off to one side creating a poorly seated component that has too big a gap between pad and endcap(and hence an open), but never a tomb
Electronics Forum | Thu Dec 11 04:25:06 EST 2008 | lconnor
I have previously experienced dispensing glue dots using a camalot system. This was used to dispense dots for a variety of components, as the SMT was applied post through hole and then wave soldered. No paste was used in the process. The other benefi
