Industry News | 2010-03-27 19:26:29.0
BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
Industry News | 2012-04-04 15:31:23.0
Known worldwide for surface-mount adhesive (SMA) development leadership, Henkel has set the industry benchmark with its high-performance Chipbonder brand adhesives. Within the company’s expansive portfolio of SMAs is
As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
Industry News | 2015-09-28 10:29:02.0
Introducing LOCTITE GC 3W – The first ever water soluble / water wash temperature stable solder paste.
New Equipment | Cleaning Agents
Chemicals & Cleaners from Loctite, Circuit Works, Chemtronics, JNJ, TechSpray, Excelta, Gordon, Menda, MicrCare, Kester, ACL, R&R, 3M, Edsyn, Hakko, OKI, Branson, Coventry, Desco, Kimberly-Clark, Puritan. Alcohol Brushes Contact Cleaners Degrea
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Industry News | 2015-04-20 09:54:25.0
Great Lakes Engineering announced today that it now distributes a revolutionary solder paste. In what is a true market breakthrough, Henkel has developed the first-ever temperature-stable solder paste: LOCTITE GC 10. GC 10 is stable at 26.5°C for one year and at temperatures of up to 40°C for one month, providing benefits throughout the logistics and operations chain, while still offering unbeatable printability and reflow performance.
Industry News | 2018-01-31 12:48:28.0
Coming off a historic 2017 during which the electronics business of Henkel Adhesive Technologies launched over 50 new products and enjoyed significant sales wins, the company is poised to have a repeat performance this year. At IPC APEX Expo in San Diego, CA, the Henkel team will showcase a host of new products in booth # 3001 and share its knowledge base in paper presentations during the event’s conference.
New Equipment | Industrial Automation
General Electric GIVEN YOUR BEST ! PLEASES mailto:unity@mvme.cn Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 General Electric Company is an Americanmultinati
