Electronics Forum | Thu Sep 02 14:02:49 EDT 2004 | russ
Frank, We are currently running lead free for approximately 1 yr. now but no where near the volumes you have mentioned. We are about 5k units per month. I personally am in agreement with you as far as OSP. I also do not like white tin finish since
Electronics Forum | Tue Jun 05 21:14:10 EDT 2001 | davef
You aren't going to post our stuff on your "Hey, I'm the wizard site", are you? Board fab, Pad coatings, OSP 1 OSPs: Imidazole (Via Systems) is good. Entek (Enthone) works, but requires strict thickness control in fab. 2 Enthone CU56 allows one t
Electronics Forum | Sat Jun 30 11:28:24 EDT 2001 | davef
Consider using a roll solder with a flux that well matches the residues you can accept to be remaining on the board when you get finished processing. Many people use a no-clean flux cored roll solder for such operations, because they don't want to c
Electronics Forum | Tue Apr 20 22:09:03 EDT 1999 | Earl Moon
| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following
Electronics Forum | Thu Oct 26 17:48:12 EDT 2000 | ptvianc
Hi: Generlly speaking, in a reactive mode, nitrogen blankets are used to improve the yield of a process that is marginal in terms of removing, and/or preventing the re-appearence of, oxides on copper features or component I/Os. That marginality can
Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c
I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh
Electronics Forum | Wed Jul 04 12:35:19 EDT 2001 | davef
I thought I responded this this a while ago, guess NOT!!! Wow, Dano yagot Entek boards that are that old!!!! Coo. Sounds kwazy that you�d end-up with that volume of old boards, but it�s probably one of those deals where correcting the problem keep
Electronics Forum | Thu Jul 22 22:18:12 EDT 2004 | davef
Notes from an AIM No-Lead Presentation ... Wave Soldering * May require a higher pot temperature than tin/lead: 255-265*C * May require a change in liquid fluxes to compensate for the poor wetting of some alloys and high thermal stresses of the wave
Electronics Forum | Mon Mar 29 09:33:37 EST 1999 | Chrys Shea
| I require some feed back from any one who knows about using a voc free flux in a nitrogen wave solder machine soldering both through hle and smt componants. | What disadvantages are there when using this flux? | Do you have any contact details with
Electronics Forum | Tue Mar 30 08:11:27 EST 1999 | George Steele
| | I require some feed back from any one who knows about using a voc free flux in a nitrogen wave solder machine soldering both through hle and smt componants. | | What disadvantages are there when using this flux? | | Do you have any contact detail
