New Equipment | Rework & Repair Equipment
Underheater for demanding soldering Applications for underheaters range from pre-heating of PCBs for hand soldering tasks over pre-heating for automated machine rework to curing or cracking of underfill. MARTIN offers a wide choice of underheater
Industry News | 2003-09-25 13:32:47.0
Reduce waste and cost.
Industry News | 2015-11-18 13:15:58.0
Albany, NY – YINCAE Advanced Materials, LLC is proud to announce that our company was awarded the 2015 Global Technology Award in the adhesives, coatings, and encapsulants category! This ceremony took place on Tuesday, November 10th at the Productronica Global Exhibition in Munich, Germany.
Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2016-02-29 09:18:03.0
Inventec introduces new enhanced co-solvent, Topklean EL20P for challenging refluxing applications, To learn more about Topklean EL20P you can visit Inventec at IPC Apex exhibition, booth 1863.
Industry News | 2012-11-08 12:01:36.0
Kyzen, will present papers at SMTA Penang Tabletop Exhibition, scheduled to take place November 16, 2012 at the Eastin Hotel Penang, Malaysia.
Industry News | 2018-09-04 15:51:06.0
YINCAE is excited to announce that we have developed SMT 158HA, an underfill with zero outgassing that is fully compatible with flux material.
New Equipment | Rework & Repair Equipment
Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven rework technology for a wide spectrum
New Equipment | Rework & Repair Equipment
FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components. The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allo
Industry News | 2014-02-21 11:40:56.0
Metcal today announced that Paul Wood will present “Rework Challenges for Smart Phone & Tablets: Do it Right the First Time” during the Rework technical session at IPC APEX EXPO on Wednesday, March 26, 2014 from 1:30-3 p.m. at the Mandalay Bay Convention Center in Las Vegas, NV.
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