Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
Industry News | 2024-03-11 15:00:03.0
Connect with our experts and see plasma and dispensing equipment for microelectronics manufacturing in booth 3645
Industry News | 2015-09-16 11:15:59.0
Nordson ASYMTEK introduces the NexJet® NJ-8 System which improves and simplifies the dispensing process for fast-paced production environments where precision, flexibility, and long-term reliability are important. The NJ-8's ReadiSet™ 2-piece jet cartridge is quickly and easily removed, cleaned, inspected, and re-installed without tools, maximizing equipment utilization and up-time. The NexJet system is an integral part of Nordson ASYMTEK's comprehensive closed-loop dispensing systems and fully-integrated software-control of the precision jet dispensing process.
Industry News | 2016-05-17 18:32:00.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), was named the winner of SMT China's 2016 Vision Award in the dispensing category for its NexJet® NJ-8 with the ReadiSet™ jet cartridge. The Vision Awards recognizes companies for their remarkable achievements in China's electronics manufacturing industry. The Award was presented at NEPCON China, held April 26-28, 2016 in Shanghai, China.
This video describes the BEST BGA rework and BGA rework services capabilities. What is described in this movie are the people, processes and tools unique to BEST and how that impacts its customers. The advanced equipment set including multiple refl
Industry News | 2017-03-31 12:29:11.0
BEST installs and brings Up mass rework machine capability to reduce costs and increase the turnover of boards requiring lots of parts change outs.
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
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