Industry News | 2010-12-07 14:47:59.0
Following European Parliament agreement of the final text of the new RoHS Directive on November 24, ENVIRON and IPC— Association Connecting Electronics Industries® present an exclusive webinar to provide essential information on the new compliance requirements for manufacturers, importers and distributors. The RoHS Directive Recast Webinar will be held Thursday, December 16, 10:00 am to 11:00 am U.S. Central time (4:00 pm to 5:00 pm Central European time).
Industry News | 2011-06-20 19:55:16.0
IPC Midwest Conference & Exhibition will be held September 21–22, 2011, at the Renaissance Schaumburg Hotel & Convention Center in Schaumburg, Ill. After being a co-located event in Rosemont in 2010, IPC Midwest will be produced solely by IPC in 2011 and will bring focused, targeted and relevant information for the electronics manufacturing and printed boards industries.
Industry News | 2016-09-29 20:22:45.0
IPC – Association Connecting Electronics Industries® in partnership with Surface Mount Technology Association (SMTA) will host High-Reliability Cleaning and Conformal Coating Conference, October 25–27, at the Hyatt Rosemont in Rosemont, Ill. The 2016 conference will focus on electronics assembly and the influence of cleanliness and coating on producing reliable hardware.
Industry News | 2017-04-11 21:32:40.0
SMTA and SMART Group announce experts from IBM Corporation and Siemens AG will keynote the Contamination, Cleaning and Coating Conference. The conference is scheduled May 22-24, 2017 at the Radisson Blu Airport Hotel in Amsterdam.
Industry News | 2018-06-03 19:35:57.0
Nordson ASYMTEK will showcase a powerful array of dispensing and conformal coating systems and valves at SMT Nuremberg 2018, Nuremberg Germany, from June 5-7, in the SMARTec stand 4-401. In addition, the Spectrum™ II S2-900 precision fluid dispensing system and the Thermal Cure TC-2400 for curing underfill will be demonstrated in the Future Packaging line at Stand 5-434.
Industry News | 2010-04-19 12:56:32.0
BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.
Industry News | 2017-05-10 18:15:53.0
Nordson ASYMTEK and Nordson MARCH, Nordson companies (NASDAQ: NDSN), will present papers at the Conformal Coating Materials and Processes session at the Contamination, Cleaning, and Coating Conference being held in Amsterdam, Netherlands. Transitioning from Manual to Automated Conformal Coating, by Michael Szuch, Nordson ASYMTEK and Optimizing the Plasma Treatment Process Prior to Conformal Coating to Eliminate ESD Induced Failures, by David Foote, Nordson MARCH, will be presented on Wednesday, May 24, 2017.
Industry News | 2023-10-09 09:12:51.0
Smt Xtra is pleased to announce plans to exhibit in Booth #1426 the upcoming SMTA International 2023 event. This prestigious exhibition is scheduled to take place Oct. 9-12, 2023 at the Minneapolis Convention Center in Minnesota. The event will provide a platform for SMT Xtra USA Inc. to showcase its latest innovations in SMT Machine Feeders, Nozzles, Replacement Machine Parts, and Consumable items.
Industry News | 2017-08-01 06:01:06.0
The SMTA Capital Chapter is pleased to announce that Phil Zarrow of ITM Consulting, will present “The ‘Deadly Sins’ of SMT Assembly” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
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