The EMPF serves as a corporate residence of expertise in electronics manufacturing.
Industry Directory | Manufacturer's Representative
Cisco designs, manufactures, and sells Internet protocol (IP)-based networking and other products related to the communications and IT industry and provide services associated with these products.
Events Calendar | Thu May 23 00:00:00 EDT 2019 - Thu May 23 00:00:00 EDT 2019 | Raleigh, North Carolina USA
Improving Reliability of Circuits Assemblies Workshop
The ADIO-104 blends the most requested analog and digital I/O functions in a single PC/104 compliant module. The sixteen single-ended 12-bit analog inputs are independently programmable to operate in one of four ranges: 10V, 5V, +5V or +10V. A spe
Technical Library | 2019-05-01 23:18:27.0
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.
Technical Library | 2023-04-17 17:05:47.0
In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these returned parts contributed to a fail, most companies will perform failure analysis (FA) on the returned parts to determine the root cause of the failure. Failure can occur for a multitude of reasons, for example: wear out, fatigue, design issues, manufacturing flaw or defect. This information is then used to improve the overall quality of the product and prevent reoccurrence. If no defect is found, it is possible that in fact the product has no defect. On the other hand, the defect could be elusive and the FA techniques insufficient to detect said deficiency. No-clean flux residues can cause intermittent or elusive, hard to find defects. In an attempt to understand the effects of no-clean flux residues from the secondary soldering and cleaning processes, a matrix of varying process and cleaning operation was investigated. Of special interest, traveling flux residues and entrapped residues were examined, as well as localized and batch cleaning processes. Various techniques were employed to test the remaining residues in order to assess their propensity to cause a latent failure. These techniques include Surface Insulation Resistance1 (SIR) testing at 40⁰C/90% RH, 5 VDC bias along with C32 testing and Ion Exchange Chromatography (IC). These techniques facilitate the assessment of the capillary effect the tight spacing these component structures have when flux residues are present. It is expected that dendritic shorting and measurable current leakage will occur, indicating a failing SIR test. However, since the residue resides under the discrete components, there will be no visual evidence of dendritic growth or metal migration.
Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Other
ProMedUSA Pte Ltd is Asia's largest distributor of Ozone Generators for air purification, odour removal and water treatment. Our products are manufactured in Vancouver Canada and guaranteed for 6 yrs
Used SMT Equipment | In-Circuit Testers
Anritsu S331E Anritsu S331E Sitemaster - Anritsu is pleased to introduce its eighth-generation compact handheld Site Master cable and antenna analyzer series with integrated spectrum analyzer. The new Site Master analyzers offer the same ease of
Used SMT Equipment | In-Circuit Testers
Anritsu S331E Anritsu S331E Sitemaster - Anritsu is pleased to introduce its eighth-generation compact handheld Site Master cable and antenna analyzer series with integrated spectrum analyzer. The new Site Master analyzers offer the same ease of
Used SMT Equipment | In-Circuit Testers
Anritsu S331E Anritsu S331E Sitemaster - Anritsu is pleased to introduce its eighth-generation compact handheld Site Master cable and antenna analyzer series with integrated spectrum analyzer. The new Site Master analyzers offer the same ease of
