Electronics Forum | Tue Jun 04 18:03:25 EDT 2002 | arzu
I recognize this problem as well, building only prototypes with all attention possible, the (small) networks need extra attention for they show opens. Maybe it helps to increase the placementforce a bit to increase the contact area to the paste befor
Electronics Forum | Wed Jan 08 14:18:34 EST 2003 | soupatech
I have run across a resistor array whose tape has a 2mm pitch. Is there a way to modify a Fuji CP3 8x4 feeder to make it 8x2? Or do I need to purchace new feeders?
Electronics Forum | Thu Mar 27 11:49:18 EST 2003 | kenlchin
In printing,the thickness of solder paste perpendicular to the Squegge direction is always lower 1 mil than that parallel to the Squegge direction,so Insufficient Solder may occur.I think you may slow printing speed or widen appertures to resolve it.
Electronics Forum | Mon Sep 23 01:28:13 EDT 2019 | sssamw
Cannot understood your problem very clearly, please check IPC standard on QFN and its mfg process, also check the QFN supplier's recommendation, so can minimize the bridge.
Electronics Forum | Wed Apr 12 16:05:08 EDT 2000 | Russ
Thanks, Dave appreciate the info. One of my trains of thought was leading to the convex because I thought that having the "bump" would allow for easier wave soldering? I did look at some data we had and did find you to be correct, the concave hav
Electronics Forum | Thu May 30 11:37:27 EDT 2002 | Ron Costa
Hi Ray, A couple of things to look into: 1.date code of reel 2. what is the termination made up of tin/lead or tin/lead/palladium. Check with part manufacturer. 3.paste volume/aperture openings 4.PCB plating 5.solder paste formulation Good luck R
Electronics Forum | Wed Mar 26 19:11:52 EST 2003 | russ
Tell us more about your printer. squegge blade type ,speed, snap-off distance etc... You shouldn't have to change apertures for any component based upon its rotation. the parts that are coming out good could they withstand a higher volume print? You
Electronics Forum | Mon Jan 18 14:01:47 EST 2010 | cl
Good Afternoon, Is this by chance a Pb BGA on a RoHS board? We had an issue with a Pb BGA on a RoHS board where we experienced "ball drop" on the Pb BGA. This was due to the heat required to reflow the RoHS paste. It was more than the Pb BGA could
Electronics Forum | Tue Jan 19 09:45:06 EST 2010 | pcbrookie
You nailed it. After some further investigation, it appears we had some old Pb version of this part that never got scrapped. Corrective action has been taken, and all the Pb parts have been disposed of. It makes sense that this would happen to the
Electronics Forum | Thu Mar 28 15:53:49 EDT 2019 | SMTA-Jon
As a CM, we don’t have a lot of input on the PCB layouts we receive. Some engineers/software packages output the paste layer 1 to 1, some do an across the board reduction, and some set each part up individually with different reductions per footprin
