Electronics Forum | Wed Aug 23 17:06:40 EDT 2000 | Dr. Ning-Cheng Lee
For 20 mil pitch pads, the volume control is more critical in terms of bridging concern. In general, solder paste for dispensing is more prone to slumping due to low metal load and low viscosity. If the volume dispensed is on the high end, or if the
Electronics Forum | Thu May 11 12:44:04 EDT 2006 | slthomas
One of our customers' products has a couple of adjacent 0603 packages (one resistor, one cap) that are .010" apart. They are side by side, not end to end. The adjacent pads between the two parts are electrically connected so bridging isn't an issu
Electronics Forum | Mon Jun 07 22:30:28 EDT 1999 | Dave F
| | | I was wondering what measurements are used to define pitch? | | | | | Frank: John's correct with the most common definition, but there can be others, depending on your perspective. TTYL Dave F | | | | Pitch. The center-to-center spacing b
Electronics Forum | Tue Oct 24 11:26:03 EDT 2006 | geb
Hi, I've had some trouble with one of my GSM cameras. Its a 1 mil camera (in circular housing). Some components have fallen down the gap between the glass cover and the LED array closest to the rails. One of the resistors (closest to the left) has b
Electronics Forum | Mon Mar 21 12:02:09 EST 2005 | Rob
Hi Colin, Are you using the 1206 package with 4 elements or one of the higher density smaller packages? With the first type you can get them in both Convex or Concave terminations, with most of the solderability problems associated with using the C
Electronics Forum | Wed Jan 07 07:50:24 EST 2009 | ludee_circuits
I think so. My customer once assembled resistors 0402 ,by Glue+wave soldering process. But PCB must be printed soldermask bridge between 0402 SMD PADs, otherwise you would encounter short problem. Sorry I don't have any comment for recommended footp
Electronics Forum | Wed May 29 19:00:08 EDT 2002 | russ
Have been seeing a pretty fair amount ourselfs. it seems to come and go. Couple of questions 1. Are the parts shifting to one side during reflow? 2. is it true non wetting to the component? I have been experimenting with different pad geometries a
Electronics Forum | Mon May 19 09:29:59 EDT 2003 | bradlanger
Dave, We are using Kester Easy Profile 256 No clean Sn62Pb36Ag02. The oven itself is a Dima SMRO-0252 which is a short oven, it has 13" of preheat, 13.5" of soak, 6.25" of reflow, and 10" of cooling on the way out of the oven. We are soldering multi
Electronics Forum | Fri Jul 15 14:16:09 EDT 2005 | seaK
We have this problem for a long time. It happens to 3 new Mydata MY-9 machine. When pick and place resistor array 0408 (different value, top and bottom side), the solder paste in the middle two terminals missing occasionally. Thought it's because noz
Electronics Forum | Mon Sep 23 10:45:34 EDT 2019 | slthomas
I have seen similar things happen with over etching and bridging but frankly the most common mistake that gives us grief is a failure to use the component manufacturer's recommended land pattern and/or aperture designs. As opposed to generating a n
