Electronics Forum | Fri Oct 22 07:31:24 EDT 2004 | davef
We're unclear about what you're seeking, but in order to move the conversation along, are you looking for: IPC-SM-782A - Surface Mount Design & Land Pattern Standard ANSI Approved Get up-to-date land pattern recommendations for ball grid array pac
Electronics Forum | Mon Jul 30 11:19:00 EDT 2001 | hinerman
A flexible array support system is superior in the following categories discussed in the 'tooling classes' thread. -High Flexibility -Effective on a variety of products -Low operator intervention -Conforms to PCB, so it is both accurate and repeatab
Electronics Forum | Mon Oct 08 23:17:48 EDT 2001 | Brad Arnold
We are trying to produce a PC Card bus assembly with a 672 pin BGA on one side. These pcb's are .015 thick. I believe the ball pitch is .5mm. The pcb's are plated with white tin. The pcb's are in a 1 X 3 array. We had 2 plates with appropriate cutout
Electronics Forum | Thu Sep 11 15:23:31 EDT 2003 | Peter L.
I have come across a rash of failed assemblies that have 0805 capacitors and resistors, bottom side glued, wave soldered and washed. Trouble shooter reported touching up the solder joints on a few areas and the boards would pass test. I had a look a
Electronics Forum | Thu Dec 16 15:06:32 EST 2010 | rway
I would go with AOI. Reasons are: --AOIs are faster --They have more coverage. Given, you cannot test the value of components, but the AOI will ensure that all resistors are correct, orientation of ICs are proper and components are present on the
Electronics Forum | Tue Mar 01 11:19:47 EST 2011 | jeddmartens
I have no knowledge into PCB designing with surface mount components, all my experience has been with through hole components. I now have to design PCBs using surface mount parts. I have a few questions I was hoping someone could answer. Can a PCB w
Electronics Forum | Mon May 26 04:39:49 EDT 2014 | sarason
Damn near impossible. You need to see a real change in the difference between the 2 elements you are reading. So to give yourself any hope run 2 long traces one top one bottom up the length of the board. Then compare to 2 wriggly traces at one end (o
Electronics Forum | Sun Aug 28 23:53:58 EDT 2016 | aemery
I don't think there is a camera off message in the software, but I might be wrong. So I am making a bit of an assumption here that you didn't have a displayed image and your error was a fiducial not found error. I am also wondering if you decided to
Electronics Forum | Mon Dec 08 18:52:47 EST 2003 | Craig M
Stability of process is what your measuring so lets not assume a stable process(if your process was perfect you would have no defects). With no test a medium complexity board will be around 68.7% (according to Consulogic). I dont have many other sour
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
