New Equipment | Solder Paste Stencils
PNC Inc. uses LPKF Laser Technology to manufacture SMT Solder paste stencil, high tolerance aperture openings with superior registration for it’s solder paste stencils. With it’s 4 mil beam diameter, our Laser is capable of cutting small aperture ope
Parts & Supplies | Pick and Place/Feeders
JUKI E95947250A0 CSP BLUE LIGHT CABLE ASM JUKI E9594729BA0 CSP LIGHT CABLE (L) ASM JUKI E95957290A0 VCS.S.V. (L) ASM. JUKI E9596729BA0 VCS.S.V. (L) ASM JUKI E95977290A0 VCS.OPT.S.V.(R) JUKI E9598729BA0 VCS.OPT.S.V.(L) JUKI E95997150A0 BAT
JUKI E95947250A0 CSP BLUE LIGHT CABLE ASM JUKI E9594729BA0 CSP LIGHT CABLE (L) ASM JUKI E95957290A0 VCS.S.V. (L) ASM. JUKI E9596729BA0 VCS.S.V. (L) ASM JUKI E95977290A0 VCS.OPT.S.V.(R) JUKI E9598729BA0 VCS.OPT.S.V.(L) JUKI E95997150A0 BATTERY A
Rectron New and Original RS407M in Stock IC RS-4M , 21+ package RS407M Bridge Rectifiers PIC16F1503T-I/MG QFN-16 Microchip 21+ 24LC128T-I/MNY TDFN-8 MICROCHIP 22+ NCP1403SNT1G SOT23-5 ON 21+ NCP1622BECSNT1G SOT23-6 ON 22+ TPS7A6650QDGNR
Industry News | 2010-09-27 23:15:26.0
VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2012-04-27 14:46:36.0
The Balver Zinn/Cobar Group introduces Tempotac (120-TEM), its newest next-generation tacky flux.
Industry News | 2021-01-19 13:51:42.0
New Micro-Measurements Advanced Sensors Technology C4A Series Strain Gages Enable Easy, No-Solder Installation
Industry News | 2014-10-30 19:03:02.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Peter Koch, European X-Ray Application Engineer, will present at their Distributor Etek’s Technology Event, scheduled to take place November 5-6, 2014 in Prestwick, Scotland. Koch will present “Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT.”
Industry News | 2015-03-03 13:11:14.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Peter Koch will present on the subject of “Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT” at the EPP Innovations Forum, scheduled to take place on Thursday, March 12, 2015 at the Kongresshalle in Böblingen, Germany.