Electronics Forum | Thu Jul 03 07:43:50 EDT 2003 | davef
So, there is a crack or gap between: * Solder and component termination. * Component termination and component body. Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the terminatio
Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs
I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle
Electronics Forum | Fri Dec 01 12:40:04 EST 2000 | Dason C
I agreed with PeteC to use the selective wave pallet, please aware TSSOP is classify as MSL 3. The advantage of the surface mounting allow both package body size and thickness to decrease but also increase the density of the package. Direct heating
Electronics Forum | Wed Feb 05 05:29:33 EST 2003 | Rajinder Sharma
If you are facing problem of craked capacitor only after breaking of the panel into individual PCB's, this may be due to stress being generated on the capacitors terminals. The stress may be due excess pressure being applied on the panel for breaking
Electronics Forum | Tue May 02 16:37:57 EDT 2006 | bhall
I have experienced the exact same problem with excess solder touching the plastic component body. The solution in my case was simply to replace the stencil. I was using a reusable stencil frame that had been worn out. I replaced the stencil with a so
Electronics Forum | Fri Nov 30 19:39:51 EST 2007 | mika
Hi chs, What type of QFN or MLF package are we talking about? Assuming there is a middle thermal pad? Body Size & no. of terminals & pitch? What about your statement: "This package is so sensitive to any external force". Can you please explain what y
Electronics Forum | Thu Jun 30 13:07:56 EDT 2022 | emeto
I have used Bi based solder pastes before. What I can say about them is that they are brittle. Joints were cracking easily. This product is something new on the market, so it might be better. Keep in mind to test it for dropping and vibration and joi
Electronics Forum | Fri Jan 26 16:24:10 EST 2007 | Bob R.
Whether there's a fillet or not depends on the component type. Most have a fillet but some, such as QFN's, don't necessarily have one. Have a look at IPC-610D Workmanship Standards to understand when you should expect one and when you shouldn't. T
Electronics Forum | Wed Jan 26 12:22:52 EST 2000 | Mikel Rodriguez
The diode doesn�t appear completely broken. It takes a bit white color (cristal break, I think), instead of the normal red/orange. It works like a 20K-200K ohm resistor. !The diode can be working properly and sometimes change to bad! I think it may
Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette
Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level
