Electronics Forum | Thu May 25 11:31:52 EDT 2006 | muse95
Patrick, I believe you are mistaken about this being a myth. Many component manufacturers changed more than plating to make their component withstand higher temps. Some changed mold compounds, others changed plastic types used. Many of these change
Electronics Forum | Mon Jul 24 13:45:14 EDT 2006 | samir
Most Test Technicians, Managers, and everyone else in the organization always believe that the BGA is the #1, and most likely failure mode in a circuit. You can analyze it with all the tools available...2D, 3D, 10D, underneath, etc...... convince th
Electronics Forum | Wed Mar 14 00:34:46 EDT 2007 | pyramus
Hi Muhammad thanks for the reply. However, this is my current situation. We are currently using some BGA's with this kind of packaging BGA over BGA. I have verified solderability of the main BGA (below Bga the one w/c will be soldered to PCB) using
Electronics Forum | Tue Apr 24 21:00:58 EDT 2018 | marlonbc
Hi All, Would just like to course through this concern on a product that we are contracted to assemble. It is mainly used for an automatic hand sanitizer dispensing product. By design there is a restrictive value of current that it needs to dissipat
Electronics Forum | Mon Nov 27 12:38:10 EST 2000 | rabell
There are a number of issues here. One is having good benchmarks prior to training. Most companies monitor production issues like inventory, scrap, rework, etc. A good ESD program would be performing frequent audits and recording deviations. Hard
Electronics Forum | Mon Oct 08 22:43:13 EDT 2001 | caldon
No wizard here just a troll....Sorry I can not spout a Fountain of information Like "The Dave F" but here is an additive..... Having worked at a Lab for testing Soaponifiers, cleanliness, and contamination when a customer says "we had a lab check it
Electronics Forum | Thu Sep 09 04:51:19 EDT 2004 | Simon UK
65%), if one failed on the board i replaced all of them, and re-tested and thermally cycled them inline with our spec (-55/+80 Deg/C for 48hrs) this was a nightmare, especially when some cracks were not detected until several weeks later while flying
Electronics Forum | Mon Feb 12 10:02:18 EST 2007 | rgduval
A little late to the party here, sorry... Has the joint been verified as a cold solder joint? That is, visually confirmed that it looks like cold solder, and, perhaps, xrayed to confirm the solder status? X-raying may sound a bit extreme, but you'
Electronics Forum | Mon Mar 17 18:37:59 EDT 2008 | aqueous
We manufacture both bulk and localized ionic contamination testers. My answer is from the perspective of the cleanliness testing method. The issue with all bulk ionic contamination testers (Ionagraph, Omegameter, Zero-Ion), is that they test the en
Electronics Forum | Fri Feb 25 02:30:32 EST 2011 | pkannan
Dstadem, Thanks for bringing your in valuable experience with the J STD 005 " Requirements of Solder Paste". I fully agree with you that the Solder Paste can be qualified for shelf life by doing simple viscosity test and visual inspection for coal
