Electronics Forum | Sun May 28 08:21:52 EDT 2000 | Sal
Can't agree more than moving over to Homebase apertures, But ensure that the cut back angle is correct,to acute of and angle will leave you with an inadequate contact area fot the terminations on the chip components and you will start seeing insuffic
Electronics Forum | Tue Oct 10 12:56:15 EDT 2000 | Ken Van ZIll
I agree that homplate is a good design, but also this could be caused by the stencil thickness and aperture size, if you are at 7-9 mils thick stencil and a 1:1 ratio on aperture size then 2 things i know of will happen, one a squishing out of past o
Electronics Forum | Thu May 06 19:21:24 EDT 2021 | markhoch
Verify your aperture reductions in the stencil. Are the solderballs always in the same location? Same size & shape? Is the solder leaching through plated thermal holes from the opposite side of the PCB? Are you using stencil apertures designed to min
Electronics Forum | Thu Jul 12 20:50:37 EDT 2001 | davef
One possible reason no one brought-up "too much paste" is that suggestion has been proffered so many times that it�s in the archives like the layers of sediment making-up Kataden. Another thing [we can argue about this], using home plate apertures w
Electronics Forum | Fri Sep 09 11:37:27 EDT 2005 | ???
Try home-plated the stencil apertures, and make "V" shape home-plated outside edges of two pads instead of between two pads.
Electronics Forum | Fri Sep 09 14:03:06 EDT 2005 | Mei
Nomorely the V-shape home-plated apertures look like two opening mouth facing each other. But this time just opposite way. And make 30% home-plated. Hope you can understand.
Electronics Forum | Fri Jul 18 16:02:25 EDT 2008 | wrongway
I think Real Chunks has your answer home plat or reverse home plate or like we use a 10% reduction on most aptures vs pad I think your problem is to much paste on the pads we used to see a lot of that with 8mil stencil thicknes on our 1206 caps went
Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric
| | :On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow
Electronics Forum | Wed Nov 05 08:49:39 EST 2003 | Axl
You might want to try reducing your stencil aperture by 10% first off; if it still swims try using a home plate design. Also if your profile is going into liquidous to fast, this might cause the swimming as well, check your profile.
