Electronics Forum | Thu May 06 19:21:24 EDT 2021 | markhoch
Verify your aperture reductions in the stencil. Are the solderballs always in the same location? Same size & shape? Is the solder leaching through plated thermal holes from the opposite side of the PCB? Are you using stencil apertures designed to min
Electronics Forum | Thu Jul 12 20:50:37 EDT 2001 | davef
One possible reason no one brought-up "too much paste" is that suggestion has been proffered so many times that it�s in the archives like the layers of sediment making-up Kataden. Another thing [we can argue about this], using home plate apertures w
Electronics Forum | Fri Sep 09 11:37:27 EDT 2005 | ???
Try home-plated the stencil apertures, and make "V" shape home-plated outside edges of two pads instead of between two pads.
Electronics Forum | Fri Sep 09 14:03:06 EDT 2005 | Mei
Nomorely the V-shape home-plated apertures look like two opening mouth facing each other. But this time just opposite way. And make 30% home-plated. Hope you can understand.
Electronics Forum | Fri Jul 18 16:02:25 EDT 2008 | wrongway
I think Real Chunks has your answer home plat or reverse home plate or like we use a 10% reduction on most aptures vs pad I think your problem is to much paste on the pads we used to see a lot of that with 8mil stencil thicknes on our 1206 caps went
Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric
| | :On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow
Electronics Forum | Wed Nov 05 08:49:39 EST 2003 | Axl
You might want to try reducing your stencil aperture by 10% first off; if it still swims try using a home plate design. Also if your profile is going into liquidous to fast, this might cause the swimming as well, check your profile.
Electronics Forum | Wed Nov 29 14:49:38 EST 2006 | MS
Any recommendation to reduce solder beads next to 0402, 0603 and 0805 caps and res? What about home plate vs. bow tie stencil aperture design?
Electronics Forum | Wed Apr 29 08:24:55 EDT 2009 | davef
Commonly when we see solder balling, we think "too much paste." As a result, we pinch the apertures or change the shape to a "home plate." We don't think that's what's going on here. But what if this component has a thicker solder plating on its ter
