Electronics Forum | Wed Nov 29 14:49:38 EST 2006 | MS
Any recommendation to reduce solder beads next to 0402, 0603 and 0805 caps and res? What about home plate vs. bow tie stencil aperture design?
Electronics Forum | Wed Apr 29 08:24:55 EDT 2009 | davef
Commonly when we see solder balling, we think "too much paste." As a result, we pinch the apertures or change the shape to a "home plate." We don't think that's what's going on here. But what if this component has a thicker solder plating on its ter
Electronics Forum | Wed Jul 03 07:29:05 EDT 2002 | jax
Where did you find this article about "U-shape" apertures? I believe it is simply talking about rounded corners on the inside of a normal square aperture. ( resembling a filled in U ). It kinda follows the same ideas behind the home-plate design, wit
Electronics Forum | Tue Aug 17 12:27:48 EDT 2010 | namruht
That reminds me...We already have home plate apertures on our stencil. Try number 2...I tried an overall reduction based on the copper layer of 10% and used oval apertures. I hope that you guys can suggest something that I am over looking. I know tha
Electronics Forum | Tue Jun 04 17:21:22 EDT 2002 | jasonfang
I found solderballs are around chip components (on one side of middle area), I checked gerber data, solder paste of aperture on the stencil for these chip components have 5% reduction to solder land on PCB, shape of solder land are square, not home p
Electronics Forum | Mon Sep 19 01:57:28 EDT 2016 | shriram
Hi guys, Problem: Mid chip solder balling. Component affected: 0603 caps only Defect is PCB specific (Meaning only one PCB is affected as the aperture is standard for that component). As a containment I'll give a home plate design for the compo
Electronics Forum | Tue Feb 04 09:03:45 EST 2003 | Russ Roberts
Greetings, I am pretty new to SMT production, and have learned much from this forum. I am getting ready to build a CCA with many 0402 parts that are really close together. I consider these fine pitch. The board also has two QFPS, so my stencil design
Electronics Forum | Fri Nov 30 08:53:17 EST 2007 | jaimebc
Shy, Our 5 and 6 mils stencils have home plate apertures and reduced by 10% and using SMT adhesive. Never had a problem with components non wetting like you have. I do believe that you are not screening enough paste, something about the dog bone ape
Electronics Forum | Wed Nov 10 18:02:54 EST 1999 | John Thorup
Hi Dave Sounds like what we call a "squeeze ball". Usually caused by excess paste squeezed over the mask between the pads of the component when placed. This sometimes escapes the pull of surface tension back to the fillet and escapes to the side, us
Electronics Forum | Tue Jun 27 11:16:33 EDT 2000 | Christopher Lampron
Hello Bill, Ioan's idea's are good. One more thing that you may want to consider is using a "Home Plate" aperture on your stencil for the aforementioned caps. The idea is to put a smaller amount of solder paste directly underneath the component. This
