Electronics Forum | Mon Aug 14 14:27:00 EDT 2017 | emeto
Here is some food for thought. Try to answer these questions yourself and I am sure you will see huge improvement. Reasons: - Bad PCB design - Plating-uneven HASL cause more than OSP Au/Ni or Silver - Poor paste and print quality - uneven paste ca
Electronics Forum | Fri Aug 07 10:14:43 EDT 1998 | RWW
| I'm currently running a double sided paste smt board loaded with 0603's, on the secondary side. Many of the 0603 devices tombstone during reflow if the parts are not perfectly centered on the pads. Is this caused by the .008 foil thickness? Has any
Electronics Forum | Wed Jul 03 07:40:48 EDT 2002 | Yannick
Hi, WE are making some test with this kind of component and aperture and here what we think. when you use a home plate aperture it's seem that the component is not lenght enought to have a good solder but maybe is our CAD guy that didn't make a
Electronics Forum | Mon Jan 17 08:09:05 EST 2000 | Mark Anderson
As stated previous, the following elements all have a effect on solder beading. Solder Paste, stencil apertures(reduction of home plate), stencil thickness, printing parameters, placement height, reflow preheat and soaking slope and dwell, manufactur
Electronics Forum | Wed Dec 22 12:39:38 EST 1999 | Dave F
Wolfgang: From US baseball parlance: Home Plate. A five sided, two dimensional, closed shape where three equal length sides form a cube with one side removed and two additional equal length sides that form interior angles of 135�, 90�, and 135�.
Electronics Forum | Thu Aug 16 13:46:06 EDT 2001 | Hussman
Hi Pavel, I'll bet you're talking after reflow - so in a nutshell - it is too much solder. Paste goes under the R or C and rests on the mask after placement. During reflow, this excess paste balls up along your part (wow, look Ma, no rocket scienc
Electronics Forum | Wed Aug 16 13:29:51 EDT 2006 | SWAG
Is 811 lead paste? If so, it seems to me that your oven settings are getting into soak awful fast in zone 2 and your peak is way high. Unless you are doing a thick board or something like that, those oven settings seem aggressive and might result i
Electronics Forum | Thu Apr 10 07:47:47 EDT 2008 | ck_the_flip
Stencil design and pad layout are key. Too far apart - bad. If your pad geometry is correct, try the inverted home plate. That has worked well for me in the past. That, coupled with a 5-mil stencil. With regard to solder paste, some manufacturer
Electronics Forum | Mon Sep 19 09:16:24 EDT 2016 | markhoch
Hi Shriram, Are you saying that there is a trace running between the pads for this 0603 capacitor? If so, this design may be causing a gasketing issue between the stencil and the PCB. The uneven height prevents the stencil from sitting flat on the PC
Electronics Forum | Tue May 02 15:09:40 EDT 2006 | PWH
Just a few problems you might have to deal with: 1) Your bare boards must be clean and kept clean though-out the process. You could notice handling contamination that might otherwise have been removed in your wash. 2) You will see solder balls a
