Industry News | 2015-06-18 17:23:06.0
IPC Association Connecting Electronics Industries® has released IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. This ever evolving standard provides common language of terms and definitions for the electronics industry.
Events Calendar | Tue Oct 15 00:00:00 EDT 2019 - Tue Oct 15 00:00:00 EDT 2019 | ,
IPC/WHMA Wiring Harness Innovation Webinar Series
Industry News | 2010-04-10 02:16:34.0
IPC has released the E revision of IPC-A-610, Acceptability of Electronic Assemblies. IPC's most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.
Industry News | 2004-09-07 18:32:13.0
NORTHBROOK, Ill., September, 2004
Industry News | 2010-06-21 15:29:58.0
BANNOCKBURN, IL — Environmental regulations on chemicals and substances continue to grow worldwide, often driven by political pressures. While some focus on manufacturing wastes, such as air and wastewater emissions, there is a growing lexicon of regulations which focus on the chemicals contained in products. To help companies understand new laws, regulations and regulatory trends, IPC will hold an IPC Symposium on Electronics and the Environment on July 19–21, 2010, in Boston, Mass.
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2015-08-20 13:42:15.0
IPC — Association Connecting Electronics Industries® has released IPC-4101D-WAM1, an amendment to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. This newly revised standard delivers trending information for base materials used for rigid and multilayer printed boards.
Industry News | 2010-06-11 15:59:00.0
BANNOCKBURN, IL — IPC — Association Connecting Electronics Industries® has released the A revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the computer and telecommunications industries, including design for reliability, design qualification testing, manufacturing conformance testing and quality processes.
Industry News | 2011-07-06 08:56:07.0
The revised European Union (EU) Restriction of Hazardous Substances (RoHS) Directive was published today in the EU Official Journal. The Directive is expected to go into effect on July 21, 2011, twenty days after publication. Member States will have 18 months to transpose the Directive into national law. Member States’ regulations are expected to take force no later than January 2, 2013.
Industry News | 2011-11-11 14:38:51.0
Want to get a handle on commonly used electronics industry acronyms and terminology? Look no further than the definitive resource, IPC-T-50J, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. Recently released by IPC, the J revision of IPC-T-50 contains nearly 400 new or revised terms, including terminology for chip scale and area array packaging, cable and wire harness technology, semiconductor packaging, assembly processing, moisture sensitive components and microvia technology.
