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FUJI Pick and Place Robot M3 III Placement

FUJI Pick and Place Robot M3 III Placement

Videos

FUJI Pick and Place Robot M3 III Placement​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place mach

Dongguan Intercontinental Technology Co., Ltd.

FUJI SMT Pick and Place Machine NXT III

FUJI SMT Pick and Place Machine NXT III

Videos

FUJI SMT Pick and Place Machine NXT III If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine,

Dongguan Intercontinental Technology Co., Ltd.

IPC Releases Revision D for IPC-6012, Qualification and Performance Specification for Rigid Printed Boards

Industry News | 2015-09-30 10:08:42.0

IPC — Association Connecting Electronics Industries® has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. IPC delivers the most current specifications for rigid printed board requirements to the electronic industry. The newly updated revision D will be release in conjunction with IPC-6012DS, Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.

Association Connecting Electronics Industries (IPC)

IPC Releases G Revisions of Two Widely Used Standards, IPC-A-610 and IPC J-STD-001

Industry News | 2017-11-07 16:56:11.0

IPC — Association Connecting Electronics Industries® has released the G revisions of the two most widely used standards in the electronic industry, IPC-J-STD-001, Requirements of Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies. These two documents are on a three-year renewal cycle, keeping pace with the everchanging technology within the electronics industry.

Association Connecting Electronics Industries (IPC)

IPC J-STD-001E Released: Industry Requirements for Soldered Electrical and Electronic Assemblies Updated

Industry News | 2010-04-10 02:07:54.0

IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.

Association Connecting Electronics Industries (IPC)

New Revision of IPC/WHMA-A-620 Released Hundreds of Enhancements Made to Cable and Wire Harness Assemblies Standard

Industry News | 2012-10-31 15:53:31.0

B revision of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. This important industry standard is a joint effort of IPC — Association Connecting Electronics Industries® and the Wire Harness Manufacturer’s Association (WHMA).

Association Connecting Electronics Industries (IPC)

Penang Chapter Webinar: 6G Manufacturing Challenges and Opportunities

Events Calendar | Wed Jul 12 00:00:00 EDT 2023 - Wed Jul 12 00:00:00 EDT 2023 | ,

Penang Chapter Webinar: 6G Manufacturing Challenges and Opportunities

Surface Mount Technology Association (SMTA)

SMTA Capital Chapter Meeting on May 6th Features “What’s New in IPC J-STD-001F and IPC-A-610F”

Industry News | 2014-03-12 18:06:44.0

The SMTA Capital Chapter is pleased to announce its second meeting of 2014 on May 6th, from 5:30 pm until 8 pm at Honeywell, 7000 Columbia Gateway Drive, Columbia, MD 21046.

Surface Mount Technology Association (SMTA)

Product Design and Early Manufacturing Involvement

Technical Library | 2020-04-01 14:24:56.0

It happens much too often; manufacturing engineers are brought into a NEW product design phase at the very end of a design and are asked to provide input that should have been provided much earlier. One needs to understand how the circuit board design and quality of the manufacturing process not only effects assembly yield and product reliability, but how it could also affect the results of any testing that is done to circuit packs during prototyping. It is important that any circuit pack (including prototypes) that will be used in reliability, performance and functional testing be designed with the proper features and assembled with a manufacturing process that has been developed to produce a high-quality assembly. If not, the results of any testing might not represent the actual characteristics of the design and provide miss-guidance to future changes.

ACI Technologies, Inc.


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