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Industry News | 2018-08-19 19:49:09.0
KIC announced that MB (Marybeth) Allen will present at the SMTA Capital Expo & Tech Forum, scheduled to take place Thursday, Aug. 23, 2018 at the John Hopkins University/Applied Physics Lab in Laurel, MD. Allen will present ‘Industry 4.0 the Next Industrial Revolution – The Smart Factory.’
Industry News | 2019-06-09 19:31:06.0
KIC announced that MB Allen, Manager for KIC’s Applications & Sales, will present at the 2nd Annual eSMART Factory Conference, scheduled to take place June 20-21, 2019 in Dearborn, Michigan. Allen will present: “Industry 4.0 the Next Industrial Revolution - The Smart Factory.
Technical Library | 2018-04-05 10:40:43.0
The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However, the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance.
Technical Library | 2019-03-15 16:26:50.0
While there have been quite dramatic and evident improvements in almost every facet of manufacturing over the last several decades owing to the advent and mass adoption of computer automation and networking, there is one aspect of production that remains stubbornly unaffected. Massive databases track everything from orders, to inventory, to personnel. CAD systems allow for interactive and dynamic 3D rendering and testing, digital troubleshooting, and simulation and analysis prior to mass production. Yet, with all of this computational power and all of this networking capability, one element of production has remained thoroughly and firmly planted in the past. Nearly all manufacturing or assembly procedures are created, deployed, and stored using methodologies derived from a set of assumptions that ceased to be relevant fifty years ago. This set of assumptions, referred to below as the “Paper Paradigm” has been, and continues as the dominant paradigm for manufacturing procedures to this day. It is time for a new paradigm, one that accounts for the vastly different technological landscape of this era, one that provides a simple, efficient interface, deep traceability, and dynamic response to rapidly changing economic forces.This paper seeks to present an alternative. Instead of enhancing and improving on systems that became irrelevant with the invention of a database, instead of propping up an outdated, outmoded and inefficient system with incremental improvements; rewrite the paradigm. Change the underlying assertions to more accurately reflect our current technological capability. Instead of relying on evolutionary improvements, it is time for a revolution in manufacturing instructions.
Industry News | 2019-04-15 18:35:13.0
KIC announced that it will exhibit at the SMTA Puget Sound Expo & Tech Forum, scheduled to take place Thursday, May 16, 2019 at the DoubleTree by Hilton Seattle Airport in Seattle, WA. MB Allen, Manager for KIC’s Applications & Sales, will discuss the new Reflow Process Inspection, RPI i4.0, automatic profiling system with integrated network software for real-time data sharing, dashboard, and traceability storage. Additionally, Allen will present “Industry 4.0 the Next Industrial Revolution - The Smart Factory.”
Industry News | 2017-04-19 16:51:06.0
SEICA SPA, which has just completed 30 years of activity, will be participating in the exhibition also this year with their own booth, to promote the Seica Group of companies and the wide range of solutions that they are able to propose to the global electronics industry.
Industry News | 2019-11-05 12:03:57.0
KIC announced that it will exhibit at the SMTA Space Coast Expo & Tech Forum on Wednesday, Nov. 20, 2019 at the Melbourne Auditorium in Florida.
Events Calendar | Tue Jul 11 00:00:00 EDT 2017 - Thu Jul 13 00:00:00 EDT 2017 | San Francisco, California USA
SEMICON West 2014
