Full Site - : rework adhesive (Page 13 of 49)

Breakthrough Concept to Bond Circuit Board Jumper Wires

Industry News | 2008-11-12 20:09:45.0

November 10, 2008 - Haverhill, MA � CircuitMedic's Flextac Wire Dots replace glues and adhesives with super-sticky tape specially designed and cut to permanently secure circuit board jumper wires. This unique wire tacking product consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive. Flextac Wire Dots conform to the shape of the wire and the board surface providing a high strength bond to quickly and neatly secure jumper wires.

Circuit Technology Center, Inc.

Reworkable Underfill Encapsulant for CSP's and BGA's

Industry News | 2003-09-25 13:32:47.0

Reduce waste and cost.

Zymet, Inc

Cobar Europe Introduces New Products from Yincae Advanced Materials

Industry News | 2010-09-16 21:44:04.0

The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.

Cobar Solder Products Inc.

Seika Machinery to Demo New Rework and Conformal Coating Systems at APEX

Industry News | 2015-01-22 11:58:02.0

Seika Machinery will debut the RD-500V Rework Station from DEN-ON INSTRUMENTS CO., LTD. in Booth #3701 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The all-in-one advanced technology SMT rework station is compatible with all kinds of rework and SMT component types, including 01005s.

Seika Machinery, Inc.

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

Industry News | 2014-07-28 15:50:58.0

Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.

YINCAE Advanced Materials, LLC.

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

Industry News | 2018-04-09 10:49:39.0

(Albany, NY)– Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.

YINCAE Advanced Materials, LLC.

Senior Engineering Microassembler

Career Center | Brooklyn, New York USA | Engineering,Production

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications.  With design, sales and manufacturing locations in over 30 countries, Mini-Ci

Mini-Circuits

Techcon Systems' Steve Collier to Present at DELO Seminar on UV Adhesives in Eindhoven in May

Industry News | 2009-05-04 16:17:50.0

May 2009 � Techcon Systems, a leading global supplier of fluid dispensing systems and accessories, announces that it will present at the DELO Seminar on UV Adhesives in Eindhoven on the 6th May 2009. Techcon Systems' European Sales Manager for the OEM Division, Steve Collier, will present a paper on best practice dispensing of UV cure adhesives using precision dispensing systems.

Techcon Systems

Techcon Systems Announces Solutions for Aerospace Industry

Industry News | 2010-08-02 12:55:28.0

Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, is pleased to announce that its plastic adhesive tools are ideal for smoothing sealants and adhesives for many aerospace applications. With sealant scrapers manufactured from Celcon®, and spatulas from glass-filled Nylon, these unique tools guarantee not to damage delicate substrates found in the aerospace industry.

Techcon Systems

PRESS RELEASE: New Product Announcement

Industry News | 2017-01-24 10:55:12.0

BP 256 is YINCAE’s new ball attach adhesive product

YINCAE Advanced Materials, LLC.


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