Industry News | 2012-01-24 20:35:41.0
AIM announces that Karl Seelig, Vice President of Technology, will discuss the reliability of lead-free alloys at the upcoming PB-Free Electronics Risk Management (PERM) Consortium Meeting, scheduled to take place January 31-February 2, 2012 in Arlington, Va.
Industry News | 2013-01-04 08:55:03.0
Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder
Industry News | 2013-07-17 13:47:09.0
JNJ Industries' SmartHolder was designed specifically for JNJ's SuperSaturated SmartWipes® canisters, to keep them readily available and easily accessible.
Industry News | 2013-10-22 15:39:58.0
Speedprint Technology will present the award-winning SP710avi and SP210avi Screen Printers in Hall A2, Booth #439 at the productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2014-09-22 10:40:15.0
YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.
Industry News | 2015-02-04 17:49:57.0
Vi TECHNOLOGY will participate in the PCB manufacturing processes workshop, scheduled to take place April 21-23, 2015 at the Kintner Equipment Corp. facility in Endicott, New York. ACE Production Technologies, Inc. has partnered with Kintner Equipment Corp. to conduct the free workshop.
Industry News | 2018-05-14 10:30:22.0
The world's first commercial diamond filled underfill.
Industry News | 2019-04-23 13:36:36.0
ACL Staticide® expands its contamination control line with the 8020 IPA Clean Swab. The high quality, cleanroom swab is ideal for the critical cleaning of small and hard-to-reach areas in many industries, including electronics and medical device manufacturing and assembly.
Industry News | 2019-08-19 15:02:03.0
YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.
Industry News | 2022-05-05 17:38:12.0
The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing will discuss solutions for voiding at the SMTA Juarez Expo & Tech Forum on Thursday, May 19.
