Electronics Forum | Fri Jan 22 14:31:14 EST 1999 | Dave F
| I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the c
Electronics Forum | Thu Dec 21 22:56:30 EST 2006 | davef
Dennis We know that cyanoacrylates are flammable and breathing hazard before curing, but are unaware that the cured adhesive had those properties also. Can you give us documentation of that fact?
Electronics Forum | Tue Oct 10 04:55:47 EDT 2000 | greg
Hi, Can anybody help me regarding "how to rework bottomside chips with adhesive without any damage on the PCB's?". What are the necessary tools we need. Thanks
Electronics Forum | Tue May 23 15:46:44 EDT 2000 | Amy Castor
I am looking for self adhesive rework pads/lands or traces. If anyone knows where these items may be acquired please email.
Electronics Forum | Mon Jun 05 14:04:36 EDT 2006 | Brian
Check with the adhesive manufacturer. Not all underfill material is reworkable. Brian
Electronics Forum | Tue Oct 10 11:12:43 EDT 2000 | derron
We have just been using a pair of hot tweezers from either pace or ersa. We are in the process of switching to the metcal brand. they seem to be the best out there.
Electronics Forum | Wed Oct 11 06:57:52 EDT 2000 | jackofalltrades
Yes, Metcals do work. The parts come off and clean-up very nicely with a hot tip. Nothing really special needed.
Electronics Forum | Wed Feb 23 21:24:42 EST 2000 | Dave F
Chris: Whatever way you decide to define your pads, use the same type on the component and the board. Non-solder mask defined pad advantages: � No point-of-stress concentration at edge mask and solder ball � No CTE mismatch at edge mask and solder
Electronics Forum | Wed Feb 23 21:24:42 EST 2000 | Dave F
Chris: Whatever way you decide to define your pads, use the same type on the component and the board. Non-solder mask defined pad advantages: � No point-of-stress concentration at edge mask and solder ball � No CTE mismatch at edge mask and solder
Electronics Forum | Thu Dec 09 07:46:42 EST 2004 | davef
We did this for BGA pads, but have not thought about other types. So, this may or may not apply for those. Pad defined by:||Advantages||Disadvantages Non-solder mask||No point-of-stress concentration at edge mask and solder ball||Smaller pads have
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