World's First Super Fast Low Temperature Underfill. SMT88U is an adhesive, which combines the advantages of fast cure in UV adhesives, and the better reliability of capillary underfill. It can be underfilled at room temperature without preheating a
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PB Technik supplies SMT equipment and materials to the Polish market. JUKI ERSA EKRA BRADY MARANTZ
Used SMT Equipment | Adhesive Dispensers
TH-2004KJ T&H Liquid Dispenser with high volume controller Features: Applicable to all kinds of fluid loading a large number. Have TH-600J is Suck-Back valve or TH-500J Diaphragm Valve Can select. Suck-Back feature eliminates post-dispense "drippin
Used SMT Equipment | Adhesive Dispensers
TH-2004KG T&H silicon dispenser Applicable rang: Applications requiring a larger volume of pneumatic pressure such as when dispensing silicone from cartridges, glue from tubes with an auto tube system, the unit exhausts a greater volume of air, wh
Used SMT Equipment | Adhesive Dispensers
TH-2004ab T&H Two component mixer/meter dispensing system Features: 1. Have a big capacity cartridge, make the time of importing materials minimum, and reduce waste. 2. Adopted with the TH-700J pneumatic double-liquid valve can
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Zetech was established in 1986 with the intention of supplying Industrial Equipment, Manufacturing Equipment, Consumable Materials, Software and Technical Support to the Electronics and Manufacturing Industry in South Africa.
Career Center | Hawthorne, California USA | Production
MANUFACTURING SPECIALIST (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively develop
Dongguan TianHao Automatic Equipment CO., LTD is the first manufacturer of fluid controlling system in China. The precise dispensing systems are applied in dispensing all kinds of adhesives, sealants, lubricants and other assembly fluids accurately a
Industry News | 2010-03-17 18:31:55.0
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
ALPHA® TETRABOND™ is the culmination of "frameless" stencil development; an elegantly simple system designed to enhance the rigidity of the foil, making safe mounting and demounting an easier proposition. Innovatively encompassed in a thin, one piece
