6/20/2023 (Albany, NY)– YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative underfill material is specifically designed to provide a fast flow, lower-temperature cure for high-
Technical Library | 2016-01-08 11:56:03.0
Solder joint encapsulant adhesives have been successfully used to enhance the strength of solder joints and improve thermal cycling as well as drop performance in finished products. The use of solder joint encapsulant adhesives can eliminate the need for underfill materials and the underfill process altogether, thus simplifying rework, which results in a lower cost of ownership.Solder joint encapsulant adhesives include: low temperature and high temperature solder joint encapsulant adhesives, and their derivatives. Each solder joint encapsulant adhesive has: unfilled and filled solder joint encapsulant adhesives, and solder joint encapsulant paste. Each solder joint encapsulant product has been designed for different applications. In this paper, we are going to discuss the details and future of solder joint encapsulant adhesives.
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
New Equipment | Cleaning Agents
KYZEN E5611 is a concentrated aqueous cleaning chemistry designed to remove non-reflowed solder paste and uncured chip bonder adhesives from stencils and hardware following the printing process. E5611 works on a wide range of solder paste technologie
New Equipment | Cleaning Equipment
SMT PCB Cleaner UC-250M-CV PCB size 50﹡50~330﹡250 mm Adhesive roll 2 rolls Width adjustment Manual Weight About 120 kg Product description: SMT PCB Cleaner UC-250M-CV， PCB size 50﹡50~330﹡250 mm, Adhesive roll 2 rolls, Adhesive roll 2 rolls, We
PACE’s Arm-Evac® 150 captures hazardous fumes locally and is suitable for benchtop soldering and electronic rework applications including handheld machining operations and light, limited use of solvents, adhesives and other light and medium duty indu
New Equipment | Solder Paste Stencils
ALPHA® Stencil products are based on unique blends of advanced technology, the experience gained from having made over half a million solder paste stencils, the specialist knowledge that could only be accumulated by a company privileged to produce bo
New Equipment | Fume Extraction
Protect your Workers from Hazardous Fumes at a Competitive Price PACE’s Arm-Evac 150 captures hazardous fumes locally and is suitable for benchtop soldering and electronic rework applications including handheld machining operations and light, limite
Industry Directory | Consultant / Service Provider
Assembly process optimization and training .
Industry Directory | Manufacturer
Since 1980, the Dr. Tresky AG company has been supplying the micro- and opto- electronics industry with innovative component placers and die bonders.
.png)
