New Equipment | Cleaning Equipment
SMT PCB Cleaner UC-250M Adhesive roll 2 rolls Width adjustment Manual PCB size 50﹡50~330﹡250 mm Weight About 100 kg Product description: SMT PCB Cleaner UC-250M, Adhesive roll 2 rolls, Width adjustment Manual, PCB size 50﹡50~330﹡250 mm, Weight
Industry Directory | Manufacturer's Representative
Manufacturers Representatives for SMT Equipment and Materials serving Southern California and Baja, MX
Technical Library | 2014-05-12 09:24:11.0
With the advancement of the electronic industry, Package on package (POP) has become increasingly popular IC package for electronic devices, particularly in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far, no customer has reported using these methods or materials in their mass production. In order to address these issues for POP assembly, YINCAE has successfully developed a first individual solder joint encapsulant adhesive.
Technical Library | 2014-06-02 11:03:45.0
With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years.
Industry News | 2001-02-26 11:18:45.0
Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.
Industry Directory | Distributor / Manufacturer / Manufacturer's Representative / Standards Setting / Certification / Training Provider
PB Technik supplies SMT equipment and materials to the Polish market. JUKI ERSA EKRA BRADY MARANTZ
Used SMT Equipment | Adhesive Dispensers
TH-2004KJ T&H Liquid Dispenser with high volume controller Features: Applicable to all kinds of fluid loading a large number. Have TH-600J is Suck-Back valve or TH-500J Diaphragm Valve Can select. Suck-Back feature eliminates post-dispense "drippin
New Equipment | Cleaning Agents
CYBERSOLV® C8882 is a fast-acting stencil cleaning solvent designed for the understencil wipe process. CYBERSOLV® C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin and low residue no-clean fluxes. CYBERS
New Equipment | Assembly Services
PCB Assembly also called Printed Circuit Board Assembly. Established in 2007, Fuchuangke Technology is found as a reliable and leading PCB Assembly Company with consistent quality and excellent service. Our expertise business ranges from Prototype Ci
New Equipment | Cleaning Agents
AQUANOX A8820D is a pour and go engineered micro-cell cleaning fluid designed to remove wet solder paste and uncured adhesive from stencils used in surface mount printing processes. A8820D removes all un-reflowed solder paste using spray-in-air and s
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