New Equipment | Solder Materials
The Malcom TK-1 Tackiness Tester is widely used to help our customers predict solder paste tack time, limiting the potential for dropped components, using either the IPC, Depth Method, or JIS Standard Test. These three convenient testing methods for
Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in
Technical Library | 2016-01-08 11:56:03.0
Solder joint encapsulant adhesives have been successfully used to enhance the strength of solder joints and improve thermal cycling as well as drop performance in finished products. The use of solder joint encapsulant adhesives can eliminate the need for underfill materials and the underfill process altogether, thus simplifying rework, which results in a lower cost of ownership.Solder joint encapsulant adhesives include: low temperature and high temperature solder joint encapsulant adhesives, and their derivatives. Each solder joint encapsulant adhesive has: unfilled and filled solder joint encapsulant adhesives, and solder joint encapsulant paste. Each solder joint encapsulant product has been designed for different applications. In this paper, we are going to discuss the details and future of solder joint encapsulant adhesives.
i-TECH ASYMTEK - Fluid Dispensing & Conformal Coating BTU - Reflow & Cure Oven Technology COGISCAN - Material/Component Tracking CYBEROPTICS - 3D Print Inspection, AOI Inspection ECMG - Printed Circuit Board Technologies
i-TECH ASYMTEK - Fluid Dispensing & Conformal Coating BTU - Reflow & Cure Oven Technology COGISCAN - Material/Component Tracking CYBEROPTICS - 3D Print Inspection, AOI Inspection ECMG - Printed Circuit Board Technologies
Dongguan TianHao Automatic Equipment CO., LTD is the first manufacturer of fluid controlling system in China. The precise dispensing systems are applied in dispensing all kinds of adhesives, sealants, lubricants and other assembly fluids accurately a
When integrated in the production line, provides 100% verification of absence and presence of glue dot dispensing before entering the placement. ScanINSPECT ADI provides 100% verification of absence/presence of glue dot dispensing before entering t
New Equipment | Cleaning Agents
IONOX® BC is a general purpose semi-aqueous solvent blend specially designed for effective removal of flux residues and dried uncured adhesives. IONOX® BC is approved for manual stencil cleaning as well as underscreen wipe applications. Manufactur
YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA 6/20/2023 (Albany, NY)– YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative
YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA 6/20/2023 (Albany, NY)– YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative
