Industry Directory | Manufacturer
Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly.
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Industry News | 2022-05-05 17:38:12.0
The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing will discuss solutions for voiding at the SMTA Juarez Expo & Tech Forum on Thursday, May 19.
Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo
There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p
| Sm | t | net |
| 1 |
