Electronics Forum | Mon Sep 28 19:07:47 EDT 1998 | Steve Gregory
| I have had some field failures returned recently, the boards had flux contamination under the components in a sensitive area, Nothing really visible until the component was removed, and the board had no evidence of rework of any type. Is it poss
Electronics Forum | Thu Sep 20 20:15:55 EDT 2001 | davef
We use glue for all kinds of purposes. [See, first we glue the lock on the office door. Then, we glue dadour locks on dakah. Next, we glue the ignition of the Benz. Now, webee gon stylin�, uh huh!] Oooops, sorry got lost there for a minute, the
Electronics Forum | Thu Oct 12 22:16:59 EDT 2000 | Dreamsniper
Hi Guys, I'd like to share this to all of you...you can start playing with the rests...Stated prices, if not indicated, are in Aussie $ or Singapore $. Stencil Printing Adhesive Pros a) Less Capital Equipment Cost (Short Term). In reality it is f
Electronics Forum | Tue Nov 28 12:00:33 EST 2000 | rabell
Deon, my first response is YES - big time. You are correct that there are some massive issues here. For one thing, lead free solders are only one solution, as conductive epoxy has also been put forward. This was demonstrated on the TAC line at Ne
Electronics Forum | Mon Jun 18 01:09:03 EDT 2001 | Dean Stadem
Igmar, If these parts are epoxied in place, and subsequently wave soldered, I would bet you a cup of coffee that they are cracking due to the thermal shock of the wave. Typically there is a valley or dip in the temperature after the pre-heat in the w
Electronics Forum | Mon Sep 22 23:27:09 EDT 2003 | severs
By "hacking" do you mean altering the performance of the board or something else? This reminds me of something I saw a while back. Better termed counterfeiting than hacking, it may have some relevance to what your friend is trying to do. The probl
Electronics Forum | Tue May 26 15:05:39 EDT 1998 | Justin Medernach
| | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | Earl Moon | Earl: We send the BGAs to a service "re-baller." Dave F | | PSI, 16833
Electronics Forum | Tue May 26 18:24:05 EDT 1998 | Earl Moon
| | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | Earl Moon | | Earl: We send the BGAs to a service "re-baller." Dave F | | | | P
Electronics Forum | Wed May 27 11:13:38 EDT 1998 | Justin Medernach
| | | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | | Earl Moon | | | Earl: We send the BGAs to a service "re-baller." Dave F | |
Career Center | GARLAND, Texas USA | Production
exp in Fuji, Juki and universal smt pick and place machines . Component verification.
