Full Site - : reworkable epoxy (Page 5 of 15)

Solder Joint Encapsulant for Ball Bumping Applications: BP 256

Industry News | 2014-09-22 10:40:15.0

YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.

YINCAE Advanced Materials, LLC.

ZESTRON will be Exhibiting at the SMTA International Expo

Industry News | 2022-10-28 05:48:36.0

ZESTRON is pleased to announce that the ZESTRON Americas team will be attending, presenting, and featuring our newest decoating products, ATRON® DC and HYDRON® SE 230A, at the SMTA International Expo & Tech Forum.

3M Electrical Solutions Division

MacDermid Alpha to Launch ALPHA HiTechHigh Tg, Low CTEUnderfill and CornerfillBonding Materials

Industry News | 2021-01-17 17:50:26.0

The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.

MacDermid Alpha Electronics Solutions

New AQS-3500 Manual Ultrasonic Stencil Cleaner

Industry News | 2001-06-26 09:54:11.0

The AQS-3500 manual ultrasonic stencil cleaning machine from JNJ Industries, Inc. can accommodate stencils up to 29" x 29". This state of the art system uses integral sweep and pulse ultrasonic generation for optimal cleaning performance. It is equipped with an ergonomically designed control panel that utilizes electromechanical switches and digital timers to control the machine functions.

JNJ Industries, Inc.

Techcon Systems' Steve Collier to Present at DELO Seminar on UV Adhesives in Eindhoven in May

Industry News | 2009-05-04 16:17:50.0

May 2009 � Techcon Systems, a leading global supplier of fluid dispensing systems and accessories, announces that it will present at the DELO Seminar on UV Adhesives in Eindhoven on the 6th May 2009. Techcon Systems' European Sales Manager for the OEM Division, Steve Collier, will present a paper on best practice dispensing of UV cure adhesives using precision dispensing systems.

Techcon Systems

AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013

Industry News | 2013-04-08 19:29:43.0

AIM Solder will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center.

AIM Solder

YINCAE Launches Breakthrough Thermal Underfill: UF 158A2

Industry News | 2023-03-27 14:51:47.0

We are thrilled to announce that YINCAE has some exciting news to share with you! We have recently introduced a breakthrough technology - thermal underfill UF 158A2 which can dramatically shorten the manufacturing process and improve the heat dissipation.

YINCAE Advanced Materials, LLC.

Techcon Launches New Extra-Large Syringe Barrel, TS60C-LL-N

Industry News | 2023-12-18 13:19:28.0

Techcon today announced the launch of their new extra-large (177 cc/6 oz) syringe barrel, TS60C-LL-N, one of the largest syringe barrels on the fluid dispensing market.

Techcon Systems

Essemtec is exhibiting at SMTconnect booth 4.209.

Industry News | 2024-06-10 10:12:04.0

We invite you to SMTconnect, Booth 4.209, from June 11 - 13 in Nuremberg, Germany. Discover Essemtec's solutions with all-in-one combined dispensing & pick-and-place processes and integrated inspection systems.

ESSEMTEC AG

Essemtec is exhibiting at APEX Expo at booth 2409.

Industry News | 2024-03-18 11:39:20.0

We are showcasing our flagship All-in-One platforms FOX and PUMA. The machines will be equipped with the latest innovations in Solder Jetting, Integrated Inspection System, Smart Material Management, and 4 mm EVO feeder – 08004 Pick-and-Place.

ESSEMTEC AG


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