Electronics Forum | Thu May 18 16:44:44 EDT 2000 | Travis Slaughter
You should be able to do it with the proper epoxy. I found one several years ago that was so strong during the sheer test the board delaminated and gave before the glue. I did not go with it for rework reasons, that�s something you might want to th
Electronics Forum | Wed Nov 17 09:02:57 EST 1999 | Dave F
John: The 180 Tg point is a sweet spot for obtaining heat resistance, cost effectivly. These high technology boards provide good thermal resistance for wire bonding, direct chip attach, and BGA mounting and rework. Since these boards are harder th
Electronics Forum | Wed Mar 14 18:17:40 EST 2001 | mparker
Some thing to watch out for is the cure spec for the adhesive. Will that match with your solder paste reflow spec? You will have two dissimiliar materials going through endothermic reactions at the same time. You could end up with under cured adhesiv
Electronics Forum | Sun Sep 02 07:55:19 EDT 2007 | lennielly
Hi every one I would like to have some inputs here,I would be very appreciated if you can give your suggestion; Currently we are working on 2 underfilled BGAs with SRT-1800 rework station(hot air type),one is mounted on a single sided PCB whereas the
Electronics Forum | Sat Jun 22 21:06:27 EDT 2002 | jersbo
I agree with PJC.. The mention of 2 QFPs to wave = more than likely rework to remove bridges and a potential to scrap the board, 25mil isnt as bad as 20 or less.. but the potential is still very real.$$$$$$ reflow/reflow is my 2 cents with the possib
Electronics Forum | Mon Sep 22 22:19:16 EDT 2003 | Dean
Questions: 1. Is this a retail product sold as PCB only? Or is this in a finished chassis / case (like an external modem)? 2. Are the customers damaging only the BGA devices? Like prying them up with a screw driver? What? You can dam and fill
Electronics Forum | Wed Sep 24 20:04:44 EDT 2003 | Michel Moninger
http://www.mgchemicals.com/products/832.html Loctite makes a version too, if I recall. Designed to be tamper evident, but yes, rework is a bear. We had similar results using one of Lord Chemical's urethane potting compounds. It was a filled black fi
Electronics Forum | Tue Nov 04 12:45:54 EST 2008 | smt123
Hi Martin, Have you considered printing the flux with a stencil? Stencils can be used for printing more than just solder paste. Quite regularly people use stencils for printing thermal grease, fluxes, conductive epoxy and more. The thing I like
Electronics Forum | Fri Nov 23 16:32:05 EST 2007 | davef
There a several things you can do to prevent the solder wicking down the hole with the current design, and that's where you should focus. Cost goes up as you go down the list, but in neither case do you need to respin the board, have solder starvatio
Electronics Forum | Fri May 26 04:58:19 EDT 2023 | auriga2001
I agree with the two other replies. Left alone, it is a defect. If it's just excess adhesive or coating, you can use IPC-7711/7721 'Rework, Modification and Repair of Electronic Assemblies' for guidance on removing. Section 2.3.1 explains how to te