One unit currently in stock for immediate shipment. Ships from California. The Chip Off Model 620 SMD Rework System features touch screen operation and programming, upper and lower spot hot air heaters, ceramic coated area heaters, HD Split-Vision
Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Technical Library | 2019-05-21 17:34:08.0
Flip chip components have been gaining popularity in the electronics industry since their introduction in the 1960s. Advances in attach methods and adhesives, as well as the drive for smaller and faster electronic devices made the technology take off. The basic premise of the flip chip is that the chip (semiconductor device) is mounted flipped from the traditional position. The traditional method of mounting a die is to mount it on a lead frame with the circuit and bond pads face up. The bond pads then receive a bond wire which then connects to the proper lead on the lead frame. Flip chips are mounted face down onto a substrate using small bumps on the bond pads to make direct electrical connection to their respective pads on the substrate. Stay tuned for more information on attachment techniques next month. This article will focus on how to rework flip chips.
Technical Library | 2020-09-02 14:34:23.0
Atomic layer deposition (ALD) is a process of creating coatings on a molecular layer by layer basis. Using an iterated sequence of self-saturating deposition cycles that are self-terminating, a single layer can be deposited at a time, allowing for highly uniform films with complete conformality. The composition of the film typically used for coating printed wiring boards (PWBs) is a high alumina (Al2O3) sequential deposition of alumina and titania capped with a corrosion protective titanium aluminate layer, most notably ALD-Cap from Sundew Technologies, LLC. Rework is a process of restoring an electronics assembly to full functionality to prolong equipment life and reduce the amount of scrap. The process typically involves:
Demo on how to reball a BGA component using a universal reball fixture.
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
Precision PCB Services, Inc. to Exhibit at the SMTA’s Tampa Bay Expo & Tech Forum, which will take place on October 5, 2021 at Embassy Suites by Hilton Tampa Airport Westshore. 555 N Westshore Blvd., Tampa Bay, Florida. Pre
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
PCB reject conveyor/AOI rework conveyor/NG PCB conveyor/NG reject conveyor, link:https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/130.html PCB reject conveyor is designed for good/bad PCB separation. It can also be used when visua
