Full Site - : reworking bga (Page 15 of 260)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Industry News | 2017-09-19 17:02:13.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Dieg

Industry News | 2018-02-12 10:15:49.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2019 in San Diego

Industry News | 2018-08-06 20:44:43.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, January 30, 2019, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2017 in San Diego

Industry News | 2016-09-22 17:27:09.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 15, 2017, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for 2014 IPC APEX EXPO

Industry News | 2013-04-03 18:46:12.0

IPC – Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2014 IPC APEX EXPO® at the Mandalay Bay Resort and Convention Center in Las Vegas.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for IPC APEX EXPO 2021

Industry News | 2020-03-08 16:23:52.0

IPC invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2021 to be held at the San Diego Convention Center. Professional development courses will be held January 23-28, and the technical conference will take place January 26-28, 2021.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for IPC APEX EXPO 2019

Industry News | 2018-03-14 15:03:10.0

IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. Professional development courses will take place January 27, 28 and 31, 2019 and the technical conference will take place January 29–31, 2019.

Association Connecting Electronics Industries (IPC)

IPC Issues Technical Conference Participation Call for IPC APEX EXPO 2016

Industry News | 2015-08-23 09:03:52.0

IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2016 at the Las Vegas Convention Center in Las Vegas. The technical conference will be held March 15-17, 2016. The deadline for technical conference paper abstracts has been extended to September 14,, 2015.

Association Connecting Electronics Industries (IPC)

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019 Deadline for technical conference paper abstracts extended to: June 29, 2018

Industry News | 2018-06-20 20:36:50.0

IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. The technical conference will take place January 29–31, 2019. The extended deadline for technical conference abstracts is June 29, 2018.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for IPC APEX EXPO 2017

Industry News | 2016-04-29 11:38:38.0

IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017.

Association Connecting Electronics Industries (IPC)


reworking bga searches for Companies, Equipment, Machines, Suppliers & Information

Void Free Reflow Soldering

World's Best Reflow Oven Customizable for Unique Applications
Sell Used SMT & Test Equipment

We offer SMT Nozzles, feeders and spare parts globally. Find out more
Circuit Board, PCB Assembly & electronics manufacturing service provider

High Precision Fluid Dispensers
PCB Handling with CE

High Throughput Reflow Oven
Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.