Industry News | 2003-05-22 08:14:29.0
RF module reference designs have been developed so that the customer can take the radio design and drop it right into their PCB or build a separate module
Industry News | 2003-06-12 08:48:13.0
Richardson Electronics named first worldwide distributor
Industry News | 2003-04-02 09:03:49.0
Configural Recognition(TM) Object and Image-Analysis Technology Enables One-Hour Program Generation
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
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Parts & Supplies | Pick and Place/Feeders
Juki led pick and place machine 24MM RF Feeder RF24AS 40175380 24mm Electronic Tape Feeder Core Components JUKI RF FEEDER Place of Origin: Japan Warranty: 6 Months Brand Name: juki Model Number: RF24AS Product name: Juki 24MM Feeder RF24AS 40
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Industry News | 2001-10-26 07:43:20.0
The Designers Learning Symposium held its first conference in the Midwest in July 2001. The Proceedings includes 473 pages of technical paper presentations, powerpoint presentations, general session presentations, and speaker biorgaphies on critical design issues. Included are papers and presentations on Routing Strategies for Autorouters, How to Get Started Using HDI/Microvias, Understanding the Value of Clean Fabrication Drawings, and PCB Design for RF Applications.
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Industry News | 2015-04-07 15:57:40.0
SMTA and Chip Scale Review magazine are pleased to announce plans for the 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.
Events Calendar | Tue Sep 22 00:00:00 EDT 2020 - Tue Sep 22 00:00:00 EDT 2020 | Eden Prairie, Minnesota USA
Risk Analysis in Electronic Assemblies
