Industry Directory | Manufacturer
Design, manufacture and distribute coaxial connectors, cable assemblies
1. HTCC Ceramic Feedthrus 2. High Frequency Design, upto 10Ghz ideal for high speed devices 3. Enhanced thermal conductivity, ideal for TEC installation 4. DWDM, WWDM, WDM, EDFA, tunable laser, EA, SOA, and CW Optical Packages for the industries of
we are a manufacturer of rf connector,including N,BNC,SMA,TNC,F,UHF,MUHF,MCX,FME,adaptor connector made by brass/becu/bronze materials in lathe machine over 16 years.
Electronics Forum | Tue Jul 26 11:02:30 EDT 2005 | dphilbrick
I have a single sided PCB that contains 4 RF connectors that will require conformal coating. Sounds easy, well the RF connector is .080 in diameter and stands a whole .050 in height. The sub-straight that the barrel sits on is about .020 thick. I don
Electronics Forum | Wed Oct 07 15:46:36 EDT 2020 | tamasmagyar
Hi Hearse, I currently use a MY600, with a AG Ejector which can place dots between 0.33 and 0.52 mm. The differences for a MY600 with placing small dots is down to ejector and paste. To be able to place dots as small as 0.25 mm, you would need an
Used SMT Equipment | Pick and Place/Feeders
Hitachi Mounter SIGMA G5 Features: SIGMA G5 models can be mounted spotlights television sets, LED lamp shade, and is the only ultra-fast, turret structure mounted transparent lamp placement machine! Hitachi SIGMA G5 parameters Mounting head st
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight N4431B Agilent/HP N4431B ECal Module, 9 kHz to 13.5 GHz, 3.5 mm, 4-port The Agilent N4431B RF electronic calibration (ECal) module makes calibration of vector network analyzers fast, easy, and accurate. ECal is a precision, sin
Industry News | 2003-06-12 08:48:13.0
Richardson Electronics named first worldwide distributor
Industry News | 2018-01-15 13:37:11.0
The SMTA is pleased to announce the Best Papers from SMTA International 2017. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.
Parts & Supplies | Air / Vaccuum
JUKI GENUINE REPLACEMENT PARTS JUKI 2020 IC HEAD EJECTOR UNIT 40010679 VPX-0443 V6C-AC-JU Specifications: Brand Name JUKI EJECTOR Part number 40010679 Model Number VPX-0443 V6C-AC-JU Ensure Test in machine confirmation Guarantee One month
Parts & Supplies | Pick and Place/Feeders
Email= happy@qy-smt.com Wechat= hpy246322 Skype= h4happyraj ------------------------------------ E9626729000 DRIVER(FOR 4 SHAFT MNLA) E9626901000 PRESSURE CONNECTOR E9627252A00 CONTACT E9627727000 CCD CAMERA CS4200J E9627729000 Z/THETA D
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
ALL-IN-ONE: JOT G3 Final Tester. It enables fully automated tests of mechanical, RF, electrical, audio, and visual interfaces.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Brooklyn, New York USA | Engineering,Management
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
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Advanced Electronic Connector Technologies News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Advanced Electronic Connector Technologies Military electrical connectors have
Advanced Electronic Connector Technologies News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Advanced Electronic Connector Technologies Military electrical connectors have
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