Industry Directory | Manufacturer
RF Electronics provides a customized integrated RF Shield Box for manual or automatic testing at an off-the-shelf solution price. Our Pre-Certified testbed services include equipment assembly, systems integration, and testing
supplier of clad & pure nickel powders and conductive fillers; additives used in the formulation of thermally & electrically conductive polymers, elastomers (emi gaskets and seals) & plastics with rf emi shielding properties.
Two-piece Drawn RF Shields Engineering Kit, EMI Shielded Cans, RF Shielding Cabinets for PCB, Board Level Shielding, Tin Plated Steel, SMD. Seamless Protective EMI/RFI Cages, available for purchasing online! Complimentary CAD files are available for
New Equipment | Test Equipment
LBA EMFaraCage® faraday cages are EMI and RFI shielded boxes and RF test enclosures which bring convenience to device testing. The faraday cage is ideal for isolating critical systems in high field RF environments, or wherever RF ingress or egress mu
Electronics Forum | Thu May 01 11:56:04 EDT 2008 | realchunks
It sounds like this part is floating on your solder joint during reflow. You may need to redesign your pad geometry. In general with this type of clip - smaller pads are better. If you cannotcahnge pad size, try changing the openings on your stenc
Electronics Forum | Thu May 01 08:35:11 EDT 2008 | cyber_wolf
We are having issues with these parts tilting to one side during reflow. Of course when they are tilted, they have to be reworked because the shield won't fit on. Changing board design and part design is not an option.... I think there are 2 reasons
Used SMT Equipment | In-Circuit Testers
Ramsey STE5000 Wireless device testing Perfect for 802.11a, b, g Bluetooth, RFID, 3G testing Wide variety of I/O options Super isolation up to 18GHz Stock models to fit your custom applications The STE5000 enclosure represents a breakthrough
Used SMT Equipment | In-Circuit Testers
Ramsey STE5000 Ramsey STE5000 Wireless device testing Perfect for 802.11a, b, g Bluetooth, RFID, 3G testing Wide variety of I/O options Super isolation up to 18GHz Stock models to fit your custom applications The STE5000 enclosure repres
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2016-07-10 13:54:05.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), and Parker Chomerics, a Division of Parker Hannifin Corporation (NYSE:PH), are partnering at SEMICON West in Parker Chomerics' booth #6557 to demonstrate precision, high-volume spray applications for EMI coating solutions. One specific solution uses Nordson ASYMTEK's Select Coat® Conformal Coating System with a DispenseJet® applicator to apply thin coatings of Parker Chomerics' new CHO-SHIELD-604 conductive coating to achieve a target thickness of 25 µm. SEMICON West is being held at Moscone Center, San Francisco, CA, July 12-14, 2016.
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
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Parts & Supplies | Pick and Place/Feeders
Supply & repair juki ejector at a lower price: JUKI 750(760) EJECTOR E79117250A0 VP*0749 JUKI 750(760) EJECTOR (E3066700000，PISCO VBH07-46) JUKI 750(760) 4-WAY ELECTROMAGNETIC VALVE PV140507000 VQD1121W-5MO-C4-X8B JUKI 750(760) ELECTROMAGNETIC V
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Technical Library | 2023-11-06 17:08:44.0
A new process has been developed for RF shielding on compact electronic communications devices using automated solder paste dispensing. The process is known as Shield Edge Interconnect (SEI). SEI designs enable parts to be processed though underfill before placing of the RF shield and allows more complete use of valuable PCB real estate to achieve reduced form factor requirements and/or for added components on products such as smartphones and tablets. The reduced form factor creates challenges for the assembly of those devices. This process, enabled by Speedline dispensing technology, relies on extremely accurate dispensing of solder paste on copper traces located along the outer edge of the PCB. The result is a robust process solution for SEI in which proprietary closed loop dispenser, pump, vision, and software technologies enable a high volume manufacturing (HVM) process.
Ningbo Hexin customized with metal shielding cover for pcb board with reel and tape packing
Ningbo Hexin customized with metal shielding cover for pcb board with reel and tape packing
Events Calendar | Wed Apr 26 00:00:00 EDT 2017 - Thu Apr 27 00:00:00 EDT 2017 | Paris, France
2017 RaMP Workshop and Tabletop Exhibition
International Microelectronics Assembly and Packaging Society (IMAPS)
Career Center | Dallas, Texas USA | Engineering
Job description: Engineer is responsible for the design of RF, Microwave and support circuitry for miniaturized Rf/Wireless modules utilizing highlt integrated semiconductors and an array of substrate and packaging technologies. Will design, simula
Career Center | Kathmandu, Nepal | Engineering
I have been working from last 4 years in different field and post. Where i can gather different experiences and enhanced my knowledge of real field. I am really storng canididates for the technical post. Hon of bachelor in electronics and communicat
SMTnet Express, February 27, 2020, Subscribers: 34,359, Companies: 10,970, Users: 25,651 Dispensing EMI Shielding Materials: An Alternative to Sputtering Credits: Nordson ASYMTEK Shielding electronic systems against electromagnetic interference
ORION Industries | http://orionindustries.com/pdfs/frfilm.pdf
. Low moisture absorption and high chemical resistance make it suitable for laminated EMI/RFI shields. For a display screen shield, VALOX FR1 film provides high p e rf o rmance in a t h i n gauge
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/video-library/emi-conductive-coating-solution-achieving-a-target-thickness-of-25-um
Conformal Coating System with a DispenseJet ® applicator to apply thin coatings of Parker Chomerics' new CHO-SHIELD-604 conductive coating to achieve a target thickness of 25 µm
