Industry Directory | Manufacturer
Specialist manufacturers of EMI /RF screening and shielding products
Industry Directory | Distributor / Manufacturer
DMC manufactures & supplies RF Shielded Enclosures, anechoic chambers, RF absorbers, and HEMP filters.
JUKI SMT Pick and Place Machine Surface Mount Technology System ❙ Introduce of JUKI RS-1R JUKI RS-1R is one of the new models of the JUKI Pick and Place Pachine, JUKI RS-1R smart modular mounter SMT Placement, JUKI SMT mounter, JUKI chip shooter,
Automatic V-cut PCB Depanelizer Machine V-cut PCB Depanelizer Application: 1. Cutting Materials: Aluminum Board, PCB Board, Soft Fiber, clean and burr-free, high speed and effective. 2. Customer mainly from Electronics Assembly Industry like LE
Used SMT Equipment | In-Circuit Testers
Ramsey STE5000 Wireless device testing Perfect for 802.11a, b, g Bluetooth, RFID, 3G testing Wide variety of I/O options Super isolation up to 18GHz Stock models to fit your custom applications The STE5000 enclosure represents a breakthrough
Used SMT Equipment | In-Circuit Testers
Ramsey STE5000 Ramsey STE5000 Wireless device testing Perfect for 802.11a, b, g Bluetooth, RFID, 3G testing Wide variety of I/O options Super isolation up to 18GHz Stock models to fit your custom applications The STE5000 enclosure repres
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2016-07-10 13:54:05.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), and Parker Chomerics, a Division of Parker Hannifin Corporation (NYSE:PH), are partnering at SEMICON West in Parker Chomerics' booth #6557 to demonstrate precision, high-volume spray applications for EMI coating solutions. One specific solution uses Nordson ASYMTEK's Select Coat® Conformal Coating System with a DispenseJet® applicator to apply thin coatings of Parker Chomerics' new CHO-SHIELD-604 conductive coating to achieve a target thickness of 25 µm. SEMICON West is being held at Moscone Center, San Francisco, CA, July 12-14, 2016.
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
JUKI SMT Pick and Place Machine Surface Mount Technology System ❙ Introduce of JUKI RS-1R JUKI RS-1R is one of the new models of the JUKI Pick and Place Pachine, JUKI RS-1R smart modular mounter SMT Placement, JUKI SMT mounter, JUKI chip shooter,
Ningbo Hexin customized with metal shielding cover for pcb board with reel and tape packing
Events Calendar | Mon Sep 21 18:30:00 UTC 2020 - Mon Sep 21 18:30:00 UTC 2020 | Eden Prairie, Minnesota USA
Risk Analysis in Electronic Assemblies
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Space Coast Event: Maximizing Automation Efficiency: Are You Making the Most of Your Investment?
Career Center | Dallas, Texas USA | Engineering
Job description: Engineer is responsible for the design of RF, Microwave and support circuitry for miniaturized Rf/Wireless modules utilizing highlt integrated semiconductors and an array of substrate and packaging technologies. Will design, simula
Career Center | Norfolk, Virginia USA | Engineering,Maintenance,Management,Production,Purchasing,Quality Control,Research and Development,Technical Support
Jay Selter Test Engineer / Technician; Formal Education: Schools and Courses completed. BROOKLYN TECHNICAL HIGH SCHOOL, NEW YORK: Electrical engineering design (two year major): Meter design and construction; Transformer design and materials; Moto
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5101
Moisture Effects in Common Solderable RF Connector Dielectrics Part II: Characterization of Damage Threshold Moisture Level for Moisture/Reflow Sensitive Polymers 中文
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