Industry News | 2019-02-19 20:12:00.0
Hanwha, formerly Samsung C&T Automation, commemorated the induction of the HM520, the first Hanwha machine to be built from the ground up under the company’s new name, at a ribbon cutting ceremony which took place Tuesday, January 29 at the IPC APEX Expo in San Diego, CA. The HM520 Cutting-Edge Modular Mounter was also awarded a prestigious NPI award at the show in the category of Component Placement – High-Speed.
Industry News | 2018-07-19 20:30:51.0
SHENMAO America is pleased to introduce the PF606-PW215 water-soluble solder paste. The company offers a full line of water-soluble fluxes and solder pastes for SMT and IC packaging applications. SHENMAO provides halide-containing and halide-free fluxes for tin/lead as well as lead-free solder alloys.
Industry News | 2011-07-06 07:52:00.0
Engineered Conductive Materials introduces its DB-1538-2 Conductive Stringer Attach Adhesive, which is designed for use in thin-film, organic and thinned silicon solar modules.
Industry News | 2012-08-10 07:00:10.0
Engineered Conductive Materials introduces its new fast curing Conductive Adhesive CA-100 for stringing and bussing next-generation CIGS solar modules.
Industry News | 2014-09-16 11:29:42.0
Engineered Material Systems will introduce its new 561-147 Snap Cure Conductive Adhesive in Hall 1, Booth E19 at EU PVSEC, scheduled to take place Sept. 23-25, 2014 at the RAI Convention & Exhibition Centre in Amsterdam.
Industry News | 2015-08-23 14:25:07.0
Engineered Material Systems, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus Bar silicon solar modules.
Industry News | 2016-05-09 21:08:21.0
Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at the Intersolar/EU PVSEC show, scheduled to take place June 23-25, 2016 in Munich. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.
Industry News | 2016-07-07 14:54:56.0
Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America, scheduled to take place July 12-14 in San Francisco, CA. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.
Industry News | 2017-03-14 10:58:12.0
Engineered Material Systems announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules. The new conductive adhesive will be displayed in Hall W3, booths 806/807 at the SNEC PV Power Expo, scheduled to take place April 19-21, 2017 in Shanghai, China.
Industry News | 2017-05-01 14:59:41.0
Engineered Material Systems announces plans to show its CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules at Intersolar Europe. The new conductive adhesive will be displayed in Hall A2, booth 319 at Intersolar Europe, scheduled to take place May 31-June 2, 2017 in Munich, Germany.
