Technical Library | 2021-11-03 16:49:59.0
Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse.
Technical Library | 2023-04-17 21:17:59.0
The purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board assemblies (PCBAs) to provide an understanding of current industry practice for ionic contamination detection limits. Design/methodology/approach – PCBAs were subjected to different flux residue cleaning dwell times and cleanliness levels were verified with resistivity of solvent extract, critical cleanliness control (C3) test, and ion chromatography analyses to provide results capable of differentiating different sensitivity levels for each test. Findings – This study provides an understanding of current industry practice for ionic contamination detection using verification tests with different detection sensitivity levels. Some of the available cleanliness monitoring systems, particularly at critical areas of circuitry that are prone to product failure and residue entrapment, may have been overlooked. Research limitations/implications – Only Sn/Pb, clean type flux residue was evaluated. Thus, the current study was not an all encompassing project that is representative of other chemistry-based flux residues. Practical implications – The paper provides a reference that can be used to determine the most suitable and effective verification test for the detection of ionic contamination on PCBAs. Originality/value – Flux residue-related problems have long existed in the industry. The findings presented in this paper give a basic understanding to PCBA manufacturers when they are trying to choose the most suitable and effective verification test for the detection of ionic contamination on their products. Hence, the negative impact of flux residue on the respective product's long-term reliability and performance can be minimized and monitored effectively.
Industry News | 2019-07-23 15:07:39.0
Z-AXIS, Inc. of western New York has signed an agreement with WEST-TECH, L.P. to represent Z-AXIS in the northeastern USA and Canada. WEST-TECH will introduce Z-AXIS’ electronic product design and contract manufacturing services to an extensive network of customers in Connecticut, Maine, Massachusetts, New Hampshire, New Jersey, Ohio, Pennsylvania, Rhode Island, Vermont, West Virginia, Ontario and Quebec.
Industry News | 2009-03-18 16:33:59.0
March, 2009. SPIN PCB Solutions adds new MyData pick and place, and MPM screen printer to their equipment list.
Industry News | 2008-01-28 21:29:53.0
WALTHAM, Mass.- Jan. 23, 2008--PerkinElmer, Inc. (NYSE: PKI), a global leader in Health Sciences and Photonics, today announced that Robert F. Friel has been elected Chief Executive Officer by the Company's Board of Directors effective February 1, 2008. He will also retain the title of President.
Industry News | 2012-10-31 18:02:00.0
Redmond - WA –October 29, 2012 - Dynamic Systems, a Redmond, Washington software developer, specializing in data collection applications has introduced rugged tablet computers for use with the CheckMate Suite of Barcode Tracking applications based on bar code technology.
Industry News | 2012-11-14 17:50:23.0
Redmond - WA –November 9, 2012 - Dynamic Systems, a Redmond, Washington software developer, specializing in data collection applications has introduced rugged tablet computers for use with the CheckMate Suite of Barcode Tracking applications based on bar code technology
Industry News | 2012-12-05 18:45:14.0
Redmond - WA – December 5, 2012 - Dynamic Systems, a Redmond, Washington software developer, specializing in data collection applications has introduced a Kiosk Wall Mount Terminal for use with the CheckMate Suite of Barcode Software applications. Launch of The Kiosk
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Industry News | 2012-07-31 11:41:20.0
Tappenden & Co Limited (TCL Group) and Lightning Circuits have announced a new partnership between DK Thermal Ltd., a division of Tappenden & Co Ltd., and Lightning Circuits. The new company will be called DK Thermal (Canada) Ltd.
