New Equipment | Fabrication Services
High Layer Count, High Complexity, High Reliability. At i3 Electronics, we offer the total package for your printed circuit board fabrication. We can design, manufacture, assemble, and test your PCB. Our specialty is high layer count, high complexi
Technical Library | 2017-06-29 16:39:30.0
Currently there is no industry standard test method for measuring dielectric properties of circuit board materials at frequencies greater than about 10 GHz. Various materials vendors and test labs take different approaches to determine these properties. It is common for these different approaches to yield varying values of key properties like permittivity and loss tangent. The D-24C Task Group of IPC has developed this round robin program to assess these various methods from the "bottom up" to determine if standardized methods can be agreed upon to provide the industry with more accurate and valid characteristics of dielectrics used in high-frequency and high-speed applications.
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1-22 Layers PCBs FR-4, Rogers, High Tg FR4, CEM-1, CEM-3, etc. Material 0.4-6.0 mm Board Thickness Lead Free HASL, ENIG, Immersion Tin, Immersion Silver, OSP etc. Treatment Green, Red, White, Yellow, Black, Blue Solder Mask
Industry News | 2010-12-03 22:31:01.0
Endicott Interconnect Technologies, Inc. (EI) announced today that the Company has added Liquid Crystal Polymer (LCP) Laminates to its family of microelectronics packaging product offerings.
Technical Library | 2018-04-18 23:55:01.0
Higher functionality, higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve the requirements of these devices, designs must incorporate fine line and via pitch while maintain good circuitry adhesion at a smooth plating-resin interface to improve signal integrity. The Semi-Additive Process (SAP) is a production-proven method used on low dielectric loss tangent (Df) build-up materials that enables the manufacture of ultra-fine circuitry. (...) This paper will discuss a new SAP process for low loss build-up materials with low desmear roughness (Ra= 40-100 nm) and excellent adhesion (610-680 gf/cm) at various processing conditions. Along with the process flow, the current work will also present results and a discussion regarding characterization on the morphology and composition of resin and/or metal plating surfaces using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX), surface roughness analysis, plating-resin adhesion evaluation from 90o peel tests
Industry News | 2015-11-16 10:47:48.0
Catching up with PNC with Dan Beaulieu, D.B. Management Group
600V *RO4350B *RO4003C Dielectric material & Stack up requirement FR-4(no copper): 0.05-3.2mm for option Prepreg type: 7628H(7630), 7628(43%), 7628(41%), 2116HR, 2116, 2113, 1080 and 1060 for option Copper
Industry Directory | Manufacturer
professional manufacturer of pcb
Industry Directory | Manufacturer
Asia Pacific Circuits is one of Asia's leading Electronic Manufacturing Services companies, committed to providing high quality PCB and PCBA Contract Electronics Manufacturing Services.
