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Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process

Technical Library | 2020-10-27 02:07:31.0

For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.

Sanmina-SCI

LOCTITE HF 212 Halogen-Free Solder Paste

LOCTITE HF 212 Halogen-Free Solder Paste

New Equipment | Solder Materials

8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr

Henkel Electronic Materials

Nikko-Rack PCB magazine rack

Nikko-Rack PCB magazine rack

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Japanese company NIX has been successfully manufacturing high quality products for over 50 years. They developed the most sophisticated PCB magazine rack available in the market today. Patented rack and pinion system allows to change PCB width witho

Nix of America

Sanmina-SCI Takes Proactive, Environmental Leadership Role

Industry News | 2003-04-04 08:31:52.0

Sanmina-SCI Corporation is solidifying its reputation for advanced technology leadership and superior quality by proactively developing lead free processes and implementing its RoHS (Reduction of Hazardous Substances) program in all facilities worldwide. In addition, the company has also undertaken a leadership initiative in educating and bringing its suppliers into alignment with its environmentally friendly programs.

Sanmina-SCI

Benchtop Batch Reflow Oven T200N

Benchtop Batch Reflow Oven T200N

New Equipment | Reflow

Benchtop Batch Reflow Oven T200N Product Description Remark: Reflow Oven T200N /Lead-Free good quality   ROHS directive has publicized. During the welding process with lead-free, all of the electron manufacturers are thinking one question how to

Beijing Torch Co.,Ltd

Benchtop Convection SMT Reflow Oven T200C

Benchtop Convection SMT Reflow Oven T200C

New Equipment | Reflow

Benchtop Convection SMT Reflow Oven T200C Product Description Honor customer : TORCH brand desktop reflow oven has got purchse order from TOP 500 enterprises: GE, CISCO, 3M, TI, NVIDIA, Nortel Network ect last year, especially GE and CISCO, totall

Beijing Torch Co.,Ltd

Quick Turn PCB for Pad with Shengyi S1141 and 1+N+1 Blind Microvias

Quick Turn PCB for Pad with Shengyi S1141 and 1+N+1 Blind Microvias

New Equipment | Prototyping

Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture

Heros Electronics (Shenzhen) Co., Ltd.

Shanxu Shortcut HK Group Ltd

Industry Directory | Consultant / Service Provider / Manufacturer

Shanxu Shortcut (HK) Group Co., Ltd is a China-based high-quality PCB manufacture, PCB assembly, components sourcing and electronic design services supplier

PCB Manufacturing - USA

PCB Manufacturing - USA

New Equipment | Assembly Services

Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e

PNC Inc.

Component Kitting

New Equipment | Other

Thanks to the resources and track record of the Paragon Electronics Group, Vigilant can provide its customers with the industry leading Total Component Management™ (TCM®) electronic component kitting services. Uniting our core skills of electronic co

Vigilant Components


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