Full Site - : rohs process (Page 25 of 115)

SHENMAO's PF606-P276 Ultra-Low Void Paste Ensures High Joint Strength

Industry News | 2024-05-13 10:19:11.0

SHENMAO Technology is pleased to offer its PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. PF606-P276 has been specifically developed for the surface mount technology (SMT) process, offering superior void performance after the reflow process. By minimizing gas generation during reflow, this solder paste ensures exceptional reliability and performance for a wide range of electronic components and assemblies.

Shenmao Technology Inc.

Indium Corporation Features New Halogen-Free Pb-Free Solder Paste at APEX

Industry News | 2009-02-11 23:22:16.0

ndium8.9HF Solder Paste is a halogen-free Pb-free solder paste with unsurpassed print transfer efficiency and response-to-pause printing. The advanced rheology of Indium8.9HF is ideally suited for today's advanced 0.4mm pitch and 0201 technologies.

Indium Corporation

Kyzen to Debut New Advanced Packaging Cleaning Chemistry at NEPCON South China 2011

Industry News | 2011-07-27 22:26:45.0

Kyzen will introduce AQUANOX® A4638 - its newest advanced packaging cleaning chemistry - in booth 1J50 at the upcoming NEPCON South China 2011 exhibition and conference.

KYZEN Corporation

EMS Solutions Chooses Aqua Klean for State-of-the-Art Cleaning

Industry News | 2017-03-29 07:48:12.0

Aqua Klean Systems today announced that Utah-based EMS Solutions placed an order for its T-12 Water Soluble Cleaner and DI Recirculating System during the recent IPC APEX EXPO. EMS Solutions is a premier regional EMS provider specializing in printed circuit board assemblies (PCBAs) for SMT and thru hole, RoHS and non-RoHS manufacturing, IPC-A-610 II & III manufacturing standards, harness and cable assemblies, and more.

Aqua Klean Systems

SHENMAO Develops Thermal Fatigue Resistant Solder Paste for High-Reliability Requirements

Industry News | 2022-03-14 08:20:37.0

SHENMAO America, Inc. is pleased to introduce its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy, which is designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.

Shenmao Technology Inc.

KYZEN to Conduct the Advanced Selective Soldering Process Seminar's Cleaning Session

Industry News | 2016-06-19 19:51:15.0

KYZEN is pleased to announce that Dr. Mike Bixenman will present at the Advanced Selective Soldering Process Seminar, scheduled to take place Tuesday, June 28 at Kester’s Global Headquarters in Itasca, IL. KYZEN also is a sponsor for the event.

KYZEN Corporation

New Low Residue No-Clean Flip Chip Flux SMF-D61 from SHENMAO

Industry News | 2024-02-12 13:43:22.0

SHENMAO Technology is pleased to announce the availability of its latest innovation, the SMF-D61 Low Residue No-Clean Flip Chip Flux. This advanced flux is meticulously engineered to meet the demanding requirements of flip chip dipping applications, offering exceptional performance and reliability throughout the soldering process.

Shenmao Technology Inc.

Deadline to Lead-Free: Design Chain Associates, LLC and EPTAC Corporation Announce a Major Education Milestone

Industry News | 2005-05-20 00:32:51.0

Design Chain Associates, LLC and EPTAC Corporation have educated three thousand people from over eleven hundred companies in the electronics industry throughout North America and the world on complying with environmental legislation and requirements like RoHS and WEEE.

Design Chain Associates, LLC

SHENMAO Wins Mexico Technology Award for Innovative SMBF-08 Visible No-Clean BGA Flux

Industry News | 2023-10-31 18:58:18.0

SHENMAO America, Inc. is proud to announce that it received a 2023 Mexico Technology Award for its groundbreaking SMBF-08 Visible No-Clean BGA Flux. The award was announced at a ceremony on Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo. This innovative flux has redefined surface mount technology (SMT) assembly and BGA ball mount processes, offering unparalleled visibility and performance.

Shenmao Technology Inc.

KYZEN to Discuss 3D Printing Process Resin Cleaners at RAPID + TCT

Industry News | 2022-05-05 16:56:02.0

KYZEN will exhibit at RAPID + TCT 2022, scheduled to take place May 17-19, 2022, in Detroit, MI. The KYZEN clean team will discuss the KYZEN® 3D5701 and KYZEN® 3D5420 3D Printing Process TPM Resin Cleaners at Booth #1348.

KYZEN Corporation


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