New Equipment | Board Handling - Pallets,Carriers,Fixtures
Selective solder fixtures protect bottom side SMT components & eliminate the risk of loosing parts in the solder. Our unique designs will eliminate skipping and bridging. No need to tape areas which reduces operator time and speeds up your line.
New Equipment | Industrial Automation
30 Vac, 42.4 Vpeak, or 60 Vdc) wiring per Permissible Wiring Bundling ZERO-MAX Roh’lix 1111 Linear Actuator Coupler Axial Load Bearing 3/8” 15lbs .10” Hitachi DF600-RKA Storage Array Chassis 15-Slot DAE Disk Expansion Shelf Unit Acuson S228 Li
New Equipment | Assembly Services
Supplier: Shenzhen Grande Electronics Layers:2 Application: Level Transmitter PCB Assembly - Electronic Contract Manufacturing - Grande Electronics PCB: FR4/1.0mm, 1oz finished copper Min Via: 0.2mm Surface Treatment: HASL PCBA Lead time: 2-3 weeks
New Equipment | Assembly Services
Supplier: Shenzhen Grande Electronic Layers: 4 Application: Weighing Scales PCB Assembly - Fast Electronic Prototype PCB:FR-4/1.6mm, 2oz finished copper Specialty: Large current, High heat, heavy components Surface Treatment: HASL PCBA Lead time: 3-
New Equipment | Board Handling - Conveyors
Supplier: Grande Electronics Layers: 4 Application: Attendance Control System Quick PCB Prototype Assembly- Shenzhen Grande PCB:FR4/1.6mm/1oz Min Via: 0.2mm Surface Treatment: HASL PCBA Lead time: 3-4 weeks Testing: 100% E-test Standard Warp: [D
New Equipment | Board Handling - Storage
供應商：格蘭德電子 層數：4 應用：包裝機 完整的 PCB 組裝-優質 PCBA 公司 Grande PCB：FR4/1.6mm/1oz 最小通孔：0.2mm 表面處理：ENIG PCBA 交貨時間：3-4 週 測試：100% 電子測試 標準翹曲： [Description] 1, Turnkey solution for Packaging Machine Complete PCB Assembly- PCBA Company Shenzhen Grande 2, PCB Ass
Industry News | 2003-04-04 08:31:52.0
Sanmina-SCI Corporation is solidifying its reputation for advanced technology leadership and superior quality by proactively developing lead free processes and implementing its RoHS (Reduction of Hazardous Substances) program in all facilities worldwide. In addition, the company has also undertaken a leadership initiative in educating and bringing its suppliers into alignment with its environmentally friendly programs.
New Equipment | Assembly Services
China Double Sided Circuit Boards Fabricaiton and Assembly PCBA Turnkey Manufacturer 2 Layers circuit boards PCB FR4 1.6mm PCB fabrication and assembly 1oz PCB copper thickness Shenzhen PCB and PCBA manufacturer China turnkey contract electroni
Japanese company NIX has been successfully manufacturing high quality products for over 50 years. They developed the most sophisticated PCB magazine rack available in the market today. Patented rack and pinion system allows to change PCB width witho
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
